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LC823450XBTBG

Onsemi

LC823450XBTBG by Onsemi

LC823450XBTBG by Onsemi is a consumer IC with 154 terminals in a grid array package. It operates b/w -20 to 65 °C, with supply voltage ranging from 0.93V to 1.27V. This IC is suitable for various consumer circuit applications due to its thin profile and fine pitch design.

Median Price

$11.700

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$10.400

1k+ parts

$9.310

10k+ parts

$8.760

1,000

-

$10.400

$9.310

$8.760

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$13.000

1k+ parts

$11.637

10k+ parts

-

1,000

-

$13.000

$11.637

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,366 parts In-Stock

1+ parts

$11.001

100+ parts

-

1k+ parts

-

10k+ parts

-

1,366

$11.001

-

-

-

Vyrian

USA . 5,116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,116

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,607 parts In-Stock

1+ parts

$10.422

100+ parts

-

1k+ parts

-

10k+ parts

-

1,607

$10.422

-

-

-

Corohmni

South Africa . 421 parts In-Stock

1+ parts

$11.580

100+ parts

-

1k+ parts

-

10k+ parts

-

421

$11.580

-

-

-

AZTECH Wire

Italy . 1,193 parts In-Stock

1+ parts

$16.960

100+ parts

-

1k+ parts

-

10k+ parts

-

1,193

$16.960

-

-

-

Kulean Microsystems

USA . 5,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,526

-

-

-

-

TANS Electronics

Latvia . 2,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,120

-

-

-

-

Problanco Electronics

Mexico . 1,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,520

-

-

-

-

UHIMA Technologies

Türkiye . 446 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

446

-

-

-

-

SupplyDigital Components

Austria . 430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

430

-

-

-

-

Microchip USA

USA . 144 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

144

-

-

-

-

Overview

Enhance your consumer electronics with the LC823450XBTBG by Onsemi, a cutting-edge product that delivers top-notch quality and reliability. Onsemi is a renowned manufacturer known for their innovative solutions in the consumer ICs category. This versatile IC offers a wide range of applications, ensuring seamless integration into various devices. With its sleek design and advanced features, the LC823450XBTBG provides unmatched value, benefits, and advantages to customers looking for high-performance components. Elevate your products with this exceptional offering from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is lightweight and durable, making the product ideal for consumer applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

Maximum Operating Temperature: 65 °C

High maximum operating temperature ensures reliability even under demanding conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature ensures functionality in a wide range of environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Tin/silver/copper finish provides excellent conductivity and corrosion resistance.

Width: 5.33 mm

Compact width allows for efficient use of space on the circuit board.

Minimum Supply Voltage (Vsup): 0.93 V

Low minimum supply voltage allows for energy-efficient operation.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high density packaging, ideal for consumer applications.

Technical Specifications

Other Function Consumer ICs LC823450XBTBG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B154

JESD-609 Code:

e1

Length:

5.52 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

154

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA154,12X13,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.73 mm

Maximum Supply Voltage (Vsup):

1.27 V

Minimum Supply Voltage (Vsup):

.93 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

5.33 mm

Trade Compliance

LC823450XBTBG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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