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LC823450XDTBG

Onsemi

LC823450XDTBG by Onsemi

LC823450XDTBG by Onsemi is a consumer IC with 154 terminals in a grid array package. It operates b/w -20 to 65°C, with supply voltage ranging from 0.93V to 1.27V. This IC is suitable for various consumer circuit applications due to its fine pitch and thin profile design.

Median Price

$17.860

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 943 parts In-Stock

1+ parts

$17.860

100+ parts

$12.283

1k+ parts

$11.516

10k+ parts

-

943

$17.860

$12.283

$11.516

-

Mouser Electronics

USA . 789 parts In-Stock

1+ parts

$17.860

100+ parts

$12.280

1k+ parts

$10.890

10k+ parts

-

789

$17.860

$12.280

$10.890

-

Chip1Stop

Japan . 668 parts In-Stock

1+ parts

$61.100

100+ parts

$27.100

1k+ parts

$19.600

10k+ parts

-

668

$61.100

$27.100

$19.600

-

Arrow

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$11.546

10k+ parts

-

21,000

-

-

$11.546

-

Flip Electronics (Authorized)

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,021 parts In-Stock

1+ parts

$11.546

100+ parts

-

1k+ parts

-

10k+ parts

-

2,021

$11.546

-

-

-

Digiode

USA . 922 parts In-Stock

1+ parts

$16.796

100+ parts

-

1k+ parts

-

10k+ parts

-

922

$16.796

-

-

-

Flip Electronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 488 parts In-Stock

1+ parts

$11.546

100+ parts

-

1k+ parts

-

10k+ parts

-

488

$11.546

-

-

-

Corphita

USA . 1,540 parts In-Stock

1+ parts

$15.912

100+ parts

-

1k+ parts

-

10k+ parts

-

1,540

$15.912

-

-

-

Microchip USA

USA . 1,920 parts In-Stock

1+ parts

$32.920

100+ parts

$32.450

1k+ parts

$32.220

10k+ parts

$31.980

1,920

$32.920

$32.450

$32.220

$31.980

Perfect Parts

USA . 7,141 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,141

-

-

-

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Kulean Microsystems

USA . 6,946 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,946

-

-

-

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SupplyDigital Components

Austria . 5,907 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,907

-

-

-

-

TANS Electronics

Latvia . 5,552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,552

-

-

-

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Problanco Electronics

Mexico . 1,898 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,898

-

-

-

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Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

-

UHIMA Technologies

Türkiye . 868 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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868

-

-

-

-

Overview

Looking for a reliable and high-quality consumer IC? Look no further than the LC823450XDTBG by Onsemi! With years of experience in the industry, Onsemi delivers top-notch products that exceed expectations. This versatile IC is perfect for a wide range of applications, offering customers unparalleled value and benefits. Trust Onsemi to provide you with the best solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY as the package body material provides durability and protection to the integrated circuit inside, making it a reliable choice for consumer applications.

Surface Mount: YES

Being surface mountable makes installation easier and allows for more compact designs, which is beneficial for space-constrained consumer electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape is standard and commonly used, making it compatible with a wide range of applications and easy to integrate into various systems.

Maximum Operating Temperature: 65 °C

With a maximum operating temperature of 65°C, this IC can reliably function in typical consumer electronic environments without overheating.

Minimum Operating Temperature: -20 °C

The ability to operate in temperatures as low as -20°C ensures that this IC can be used in a variety of environments and climates.

Terminal Finish: TIN SILVER COPPER

The TIN SILVER COPPER terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and longevity in use.

Width: 5.33 mm

The compact width of 5.33 mm allows for space-efficient PCB layouts and compact device designs, making it ideal for consumer electronics with size constraints.

Minimum Supply Voltage (Vsup): 0.93 V

The low minimum supply voltage requirement of 0.93 V allows for energy-efficient operation and compatibility with low-power devices, making it a cost-effective choice for consumer applications.

Technical Specifications

Other Function Consumer ICs LC823450XDTBG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B154

JESD-609 Code:

e1

Length:

5.52 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

154

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA154,12X13,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.73 mm

Maximum Supply Voltage (Vsup):

1.27 V

Minimum Supply Voltage (Vsup):

.93 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.33 mm

Trade Compliance

LC823450XDTBG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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