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LC72725KV-MPB-E

Onsemi

LC72725KV-MPB-E by Onsemi

LC72725KV-MPB-E by Onsemi is a consumer IC with 16 terminals, operating at temperatures from -40 to 85 °C. It has power supplies of 3/5V and uses CMOS technology. This rectangular-shaped IC in a plastic/epoxy package is ideal for industrial applications requiring small outline, shrink pitch packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 54,000 parts In-Stock

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Vyrian

USA . 11,966 parts In-Stock

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Digiode

USA . 228 parts In-Stock

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228

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Distributors (Availability)

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AZTECH Wire

Italy . 699 parts In-Stock

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$22.030

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699

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TANS Electronics

Latvia . 8,132 parts In-Stock

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SupplyDigital Components

Austria . 6,458 parts In-Stock

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Problanco Electronics

Mexico . 6,133 parts In-Stock

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Kulean Microsystems

USA . 4,446 parts In-Stock

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UHIMA Technologies

Türkiye . 381 parts In-Stock

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381

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Corphita

USA . 319 parts In-Stock

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Corohmni

South Africa . 88 parts In-Stock

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Overview

Transform your consumer electronics with the LC72725KV-MPB-E by Onsemi. This high-quality IC offers exceptional performance and reliability, thanks to Onsemi's reputation for excellence in manufacturing. Ideal for a wide range of applications, this product provides unparalleled value with its advanced technology and innovative design. Upgrade your devices with the LC72725KV-MPB-E and experience the benefits of superior functionality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to environmental factors, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, making the product ideal for automated manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape of the package provides ease of handling and integration into circuit designs.

Power Supplies (V): 3/5

The dual power supply options of 3V and 5V make this product versatile and compatible with a wide range of systems.

No. of Terminals: 16

Having 16 terminals allows for connectivity to multiple external components, expanding the functionality of the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature means the product can withstand extreme cold conditions without compromising functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in operation.

Technical Specifications

Other Function Consumer ICs LC72725KV-MPB-E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LC72725KV-MPB-E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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