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LC72720N

Onsemi

LC72720N by Onsemi

LC72720N by Onsemi is a CMOS consumer circuit IC with 24 terminals in an IN-LINE package. Operating temperature ranges from -40 to 85 °C, suitable for industrial applications. It operates at 5V power supply and is commonly used in various consumer electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,627 parts In-Stock

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Digiode

USA . 618 parts In-Stock

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Problanco Electronics

Mexico . 7,486 parts In-Stock

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Kulean Microsystems

USA . 5,426 parts In-Stock

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TANS Electronics

Latvia . 2,411 parts In-Stock

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SupplyDigital Components

Austria . 1,456 parts In-Stock

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Kepictronics

USA . 1,450 parts In-Stock

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Corphita

USA . 1,117 parts In-Stock

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Corohmni

South Africa . 453 parts In-Stock

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UHIMA Technologies

Türkiye . 208 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the LC72720N by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that are designed to exceed customer expectations. The LC72720N falls under the category of Other Function Consumer ICs and is suitable for a wide range of applications. With its advanced technology and durable construction, this product offers exceptional value, benefits, and advantages to customers looking for high-performance consumer circuit solutions. Trust Onsemi to provide you with the best-in-class products that meet your needs and deliver unmatched performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and heat resistance, ensuring a longer lifespan for the product.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices and circuit designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliable performance and compatibility with consumer electronics.

Power Supplies (V): 5

Operates at a standard 5V power supply, making it easily compatible with common power sources.

No. of Terminals: 24

Ample terminals for connectivity and flexibility in design and implementation.

Package Style (Meter): IN-LINE

In-line package style makes it easy to install and maintain in a circuit design.

Maximum Operating Temperature: 85 °C

Can operate in higher temperature environments, increasing the versatility of the product.

Minimum Operating Temperature: -40 °C

Ability to function in low temperature conditions ensures reliability in a variety of environments.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating makes it suitable for harsh operating conditions and industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall performance and efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and stable connections, reducing the risk of loose connections or disconnections.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy soldering and integration into circuit boards with compatible layouts.

Technical Specifications

Other Function Consumer ICs LC72720N attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

LC72720N General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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