Loading...

LC72722M

Onsemi

LC72722M by Onsemi

LC72722M by Onsemi is a CMOS consumer IC with 24 terminals in a small outline package. Operating temperature ranges from -40 to 85 °C, suitable for industrial applications. It requires a 5V power supply and features surface mount technology for easy integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 822 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

822

-

-

-

-

Digiode

USA . 463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

463

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,665 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,665

-

-

-

-

SupplyDigital Components

Austria . 5,604 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,604

-

-

-

-

Problanco Electronics

Mexico . 4,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,390

-

-

-

-

Corphita

USA . 1,557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,557

-

-

-

-

Corohmni

South Africa . 410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

410

-

-

-

-

TANS Electronics

Latvia . 187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

187

-

-

-

-

UHIMA Technologies

Türkiye . 70 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

70

-

-

-

-

Overview

Unleash the power of innovation with the LC72722M by Onsemi. Designed to exceed expectations, this consumer circuit IC offers unparalleled quality and reliability. With a wide range of applications, this product is versatile and adaptable to meet your specific needs. Trust in Onsemi's reputation for excellence and unlock the potential of your projects. Experience the value and benefits that the LC72722M brings to your work, from increased efficiency to enhanced performance. Elevate your creations with this cutting-edge technology and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to heat, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort in production.

Power Supplies (V): 5

Operating at 5 volts allows for compatibility with a wide range of electronic systems, making the product versatile in its applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can withstand high heat environments, increasing its reliability.

Minimum Operating Temperature: -40 °C

Being able to operate at low temperatures down to -40 °C makes the product suitable for various environments and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and performance of the product.

Technical Specifications

Other Function Consumer ICs LC72722M attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LC72722M General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20