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LC72711W-E

Onsemi

LC72711W-E by Onsemi

LC72711W-E by Onsemi is a 64-terminal consumer circuit IC with plastic/epoxy body, suitable for industrial applications. It operates b/w -40 to 85 °C, with supply voltage range of 4.5-5.5V. The flatpack package style has low profile and fine pitch, making it ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,303 parts In-Stock

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2,303

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Digiode

USA . 937 parts In-Stock

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937

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 8,066 parts In-Stock

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8,066

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TANS Electronics

Latvia . 7,818 parts In-Stock

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7,818

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Problanco Electronics

Mexico . 6,753 parts In-Stock

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6,753

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Kulean Microsystems

USA . 2,494 parts In-Stock

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2,494

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Corphita

USA . 884 parts In-Stock

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884

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UHIMA Technologies

Türkiye . 587 parts In-Stock

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587

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Corohmni

South Africa . 101 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the LC72711W-E by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and innovative solutions. This consumer IC offers endless possibilities in various applications, providing customers with unmatched value and benefits. Trust in Onsemi to bring you cutting-edge technology that will elevate your projects to new heights. Choose the LC72711W-E for superior performance and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the components inside, making the product reliable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing production time and cost.

Package Shape: SQUARE

Square package shape enables efficient use of PCB space and allows for easy arrangement in circuit designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature makes the product suitable for use in extreme cold environments.

Width: 10 mm

Compact width makes the product suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement allows for operation in low-power applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in industrial applications with varying temperature conditions.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and connection to the PCB, simplifying the assembly process.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance provides flexibility in power supply options for the product.

Technical Specifications

Other Function Consumer ICs LC72711W-E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

LC72711W-E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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