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LC72722PM

Onsemi

LC72722PM by Onsemi

LC72722PM by Onsemi is a consumer circuit IC with 24 terminals in a small outline package. Operating temperature ranges from -40 to 85 °C, suitable for industrial applications. It has a supply voltage range of 4.5V to 5.5V and utilizes CMOS technology for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 659 parts In-Stock

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Digiode

USA . 80 parts In-Stock

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80

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Kulean Microsystems

USA . 6,864 parts In-Stock

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6,864

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SupplyDigital Components

Austria . 6,278 parts In-Stock

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Corphita

USA . 797 parts In-Stock

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UHIMA Technologies

Türkiye . 690 parts In-Stock

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TANS Electronics

Latvia . 102 parts In-Stock

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Corohmni

South Africa . 84 parts In-Stock

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Problanco Electronics

Mexico . 70 parts In-Stock

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Overview

Enhance the performance of your consumer electronics with the LC72722PM by Onsemi. With a reputation for producing high-quality products, Onsemi delivers reliable and efficient solutions that cater to a wide range of applications in the consumer electronics industry. The LC72722PM offers customers value and benefits through its advanced technology and industrial-grade components, ensuring optimal functionality and durability. Upgrade your devices with this versatile IC and experience the advantages of Onsemi's innovative engineering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for consumer applications.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, saving space and making the product suitable for compact designs.

Power Supplies (V): 5

The 5V power supply ensures compatibility with standard power sources, making it widely usable.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliability even in challenging environmental conditions.

Technology: CMOS

The use of CMOS technology provides low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Other Function Consumer ICs LC72722PM attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.2 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.9 mm

Trade Compliance

LC72722PM General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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