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LC72715PLG

Onsemi

LC72715PLG by Onsemi

LC72715PLG by Onsemi is a consumer circuit IC with 68 terminals in a grid array package. It operates b/w -40 to 85 °C, with supply voltage ranging from 2.7V to 3.6V. This CMOS technology IC is ideal for industrial applications requiring fine pitch and thin profile components.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 218 parts In-Stock

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Vyrian

USA . 70 parts In-Stock

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70

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SupplyDigital Components

Austria . 5,385 parts In-Stock

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5,385

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Problanco Electronics

Mexico . 5,043 parts In-Stock

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TANS Electronics

Latvia . 2,724 parts In-Stock

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Kulean Microsystems

USA . 1,661 parts In-Stock

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Corphita

USA . 1,587 parts In-Stock

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Corohmni

South Africa . 459 parts In-Stock

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459

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UHIMA Technologies

Türkiye . 261 parts In-Stock

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Overview

Experience the superior quality and reliability of Onsemi's LC72715PLG, a cutting-edge consumer circuit IC designed for a wide range of applications. With a package body material made of durable plastic/epoxy and a compact square shape, this IC offers exceptional performance in a variety of environments. Whether you're in need of industrial-grade technology or a versatile solution for your consumer electronics, the LC72715PLG delivers unmatched value and benefits to meet all your needs. Trust in Onsemi's expertise and choose innovation with this high-quality IC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to external environmental factors, making this product a reliable choice for long-term use.

Surface Mount: YES

With surface mount capability, this product can be easily integrated into electronic circuit boards, allowing for convenient and efficient assembly processes.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making it suitable for applications where board real estate is limited.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, this IC is optimized for performance, power efficiency, and reliability in everyday electronic devices.

No. of Terminals: 68

The high number of terminals allows for complex connectivity and functionality, making this IC suitable for advanced consumer electronics.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile and fine pitch enables high-density packaging and reduced signal interference, contributing to improved overall performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand extended use under varying environmental conditions, ensuring reliable operation in demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for operation in cold environments without compromising performance, making this IC versatile for use in different conditions.

Terminal Position: BOTTOM

The terminal position at the bottom facilitates easy and secure connection to the PCB, ensuring stable electrical connections and efficient signal transmission.

Maximum Seated Height: 0.85 mm

The low maximum seated height enables compact integration into electronic devices with height restrictions, maintaining a sleek and slim profile.

Width: 6 mm

The narrow width of the IC allows for space-saving design possibilities, ideal for applications where size is a critical factor.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement ensures energy efficiency and reliable operation, making this IC suitable for battery-powered devices.

Length: 6 mm

The short length of the IC contributes to a compact footprint, enabling flexibility in design and placement within electronic systems.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC meets stringent quality and reliability standards, ensuring consistent performance in harsh operating environments.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making this IC suitable for a wide range of consumer electronics requiring efficient power management.

Terminal Form: BUTT

The butt terminal form provides a secure and reliable connection to the PCB, ensuring minimal signal loss and optimal performance in electronic circuits.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for dense packaging and efficient signal routing, enhancing the overall performance and functionality of the IC.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage tolerance provides flexibility in power input options, accommodating a wide range of voltage requirements in diverse electronic applications.

Technical Specifications

Other Function Consumer ICs LC72715PLG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B68

Length:

6 mm

No. of Functions:

1

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.85 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

LC72715PLG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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