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LC72720Y

Onsemi

LC72720Y by Onsemi

LC72720Y by Onsemi is a consumer circuit IC with 24 terminals, operating at temperatures from -40 °C to 85°C. It utilizes CMOS technology and has a power supply of 3.3V, making it suitable for industrial applications requiring precise control and monitoring functions. The package style is in-line with shrink pitch, providing durability and reliability in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,355 parts In-Stock

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2,355

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Vyrian

USA . 688 parts In-Stock

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688

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 5,650 parts In-Stock

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5,650

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Kulean Microsystems

USA . 4,205 parts In-Stock

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4,205

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TANS Electronics

Latvia . 2,769 parts In-Stock

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2,769

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SupplyDigital Components

Austria . 2,496 parts In-Stock

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2,496

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Kepictronics

USA . 828 parts In-Stock

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828

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Corohmni

South Africa . 373 parts In-Stock

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373

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Corphita

USA . 237 parts In-Stock

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237

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UHIMA Technologies

Türkiye . 121 parts In-Stock

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121

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Overview

Enhance your consumer electronic designs with the high-quality LC72720Y by Onsemi. As a leading manufacturer in the industry, Onsemi delivers reliable and efficient solutions for a wide range of applications. The LC72720Y offers exceptional value with its superior performance and versatility. Its advanced technology and industrial-grade temperature range make it ideal for various consumer circuit applications. Trust Onsemi to provide innovative solutions that meet your design needs and exceed your expectations. Upgrade your designs today with the LC72720Y.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides good protection for the internal components of the IC, making it durable and reliable for long-term use.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into various electronic devices and circuit designs, making it versatile for different applications.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with a wide range of systems and devices, offering flexibility in power requirements for the IC.

No. of Terminals: 24

With 24 terminals, this IC provides sufficient connectivity options for interfacing with other components and peripherals in a circuit, offering versatility in design options.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures stable performance even in demanding environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for reliable operation in a wide range of temperature environments, ensuring consistent performance in harsh conditions.

Technology: CMOS

The CMOS technology used in this IC offers low power consumption and high noise immunity, making it energy-efficient and reliable for various consumer electronic applications.

Technical Specifications

Other Function Consumer ICs LC72720Y attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LC72720Y General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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