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LC72717PW-H

Onsemi

LC72717PW-H by Onsemi

LC72717PW-H by Onsemi is a 64-terminal consumer IC with CMOS technology. It operates b/w -40 to 85 °C, suitable for industrial applications. With a low profile and fine pitch flatpack package, it supports a supply voltage range of 2.7V to 3.6V for various consumer circuit designs.

Median Price

$10.880

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

$10.880

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1,600

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$10.880

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Flip Electronics (Authorized)

USA . 1,600 parts In-Stock

1+ parts

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1,600

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,443 parts In-Stock

1+ parts

$10.880

100+ parts

-

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2,443

$10.880

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Flip Electronics

USA . 1,600 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,600

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Digiode

USA . 1,247 parts In-Stock

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1,247

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 280 parts In-Stock

1+ parts

$10.880

100+ parts

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280

$10.880

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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7,000

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Kulean Microsystems

USA . 6,044 parts In-Stock

1+ parts

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6,044

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Problanco Electronics

Mexico . 5,982 parts In-Stock

1+ parts

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5,982

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TANS Electronics

Latvia . 3,384 parts In-Stock

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3,384

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Corphita

USA . 870 parts In-Stock

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870

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UHIMA Technologies

Türkiye . 350 parts In-Stock

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350

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SupplyDigital Components

Austria . 68 parts In-Stock

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68

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Kepictronics

USA . 55 parts In-Stock

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55

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Overview

Discover the cutting-edge LC72717PW-H by Onsemi, a top-tier manufacturer in the electronics industry. This innovative consumer IC boasts a sleek flatpack design with a low profile and fine pitch, ideal for a wide range of applications. Whether you're looking to enhance your electronic devices or streamline your circuitry, this product offers unrivaled quality, reliability, and performance. Upgrade your technology today with the LC72717PW-H and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material offers good durability and protection for the IC, making it suitable for consumer applications.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient PCB assembly, saving time and effort during production.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the PCB, making it ideal for compact consumer electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can perform reliably in various consumer electronic devices across different environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the IC can function in colder environments without any issues, increasing its versatility.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement makes this IC energy-efficient and suitable for battery-powered consumer devices.

Technology: CMOS

Being CMOS technology, the IC offers low power consumption, high noise immunity, and compatibility with a wide range of consumer electronic applications.

Technical Specifications

Other Function Consumer ICs LC72717PW-H attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e6

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

LC72717PW-H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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