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LC72722PM-MPB-E

Onsemi

LC72722PM-MPB-E by Onsemi

LC72722PM-MPB-E by Onsemi is a 24-terminal CMOS IC with 5V power supply, operating from -40 to 85 °C. It comes in a small outline package suitable for consumer circuits, featuring Gull Wing terminals and industrial temperature grade. Ideal for applications requiring a compact, surface-mount solution with high reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,291 parts In-Stock

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Digiode

USA . 657 parts In-Stock

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AZTECH Wire

Italy . 499 parts In-Stock

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$10.160

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499

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Kulean Microsystems

USA . 7,573 parts In-Stock

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Problanco Electronics

Mexico . 5,643 parts In-Stock

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TANS Electronics

Latvia . 4,102 parts In-Stock

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SupplyDigital Components

Austria . 3,612 parts In-Stock

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Corphita

USA . 1,648 parts In-Stock

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Corohmni

South Africa . 311 parts In-Stock

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UHIMA Technologies

Türkiye . 12 parts In-Stock

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Overview

Enhance your consumer electronic products with the LC72722PM-MPB-E by Onsemi, a high-quality consumer IC that delivers superior performance and reliability. With Onsemi's reputation for excellence in semiconductor manufacturing, this cutting-edge component offers unmatched value and benefits for a wide range of applications. From home appliances to automotive systems, this versatile IC provides efficiency and precision, making it the ideal choice for your next project. Upgrade your devices with the LC72722PM-MPB-E and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards.

Power Supplies (V): 5

Operating at 5 volts provides a standard power supply voltage for many consumer electronic devices.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this IC is suitable for use in a wide range of environments and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC energy-efficient and reliable.

Terminal Pitch: 1.27 mm

The small terminal pitch enables high-density mounting, saving space on the circuit board.

Technical Specifications

Other Function Consumer ICs LC72722PM-MPB-E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Length:

15.2 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.9 mm

Trade Compliance

LC72722PM-MPB-E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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