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LC72715PW

Onsemi

LC72715PW by Onsemi

LC72715PW by Onsemi is a 64-terminal consumer circuit IC with CMOS technology. It operates b/w -40 to 85 °C, suitable for industrial applications. With a low profile flatpack package and Gull Wing terminals, it's ideal for compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,681 parts In-Stock

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1,681

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Vyrian

USA . 367 parts In-Stock

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367

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Kulean Microsystems

USA . 8,267 parts In-Stock

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8,267

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Problanco Electronics

Mexico . 3,330 parts In-Stock

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3,330

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TANS Electronics

Latvia . 3,193 parts In-Stock

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SupplyDigital Components

Austria . 3,158 parts In-Stock

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Corphita

USA . 2,462 parts In-Stock

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UHIMA Technologies

Türkiye . 531 parts In-Stock

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531

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Corohmni

South Africa . 324 parts In-Stock

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Overview

Enhance your consumer electronics with the LC72715PW by Onsemi. Designed with precision and quality in mind, this consumer circuit IC offers unparalleled performance and reliability. Manufactured by industry leader Onsemi, this product is guaranteed to meet your highest expectations. Its wide range of applications makes it a versatile choice for various electronic devices. Get the value and benefits you deserve with the LC72715PW - a game-changer in the world of consumer ICs. Upgrade your electronics today with Onsemi's innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the IC.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and enabling automated assembly processes.

Package Shape: SQUARE

The square package shape facilitates efficient layout and placement on circuit boards, optimizing use of available space.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand varying environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature expands the range of environments in which this IC can operate, ensuring reliable performance under extreme conditions.

Technology: CMOS

The CMOS technology used in this IC offers low power consumption and high speed, making it energy efficient and capable of handling complex functions efficiently.

Technical Specifications

Other Function Consumer ICs LC72715PW attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

LC72715PW General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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