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LC72711LW-E

Onsemi

LC72711LW-E by Onsemi

LC72711LW-E by Onsemi is a 64-terminal consumer circuit IC with a package style of flatpack, low profile, fine pitch. It operates b/w -40 to 85 °C and has a supply voltage range of 2.7V to 3.6V. Ideal for industrial applications requiring a compact design and high performance in consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 781 parts In-Stock

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Digiode

USA . 588 parts In-Stock

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Problanco Electronics

Mexico . 7,838 parts In-Stock

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SupplyDigital Components

Austria . 7,501 parts In-Stock

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Kulean Microsystems

USA . 7,125 parts In-Stock

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Kepictronics

USA . 4,015 parts In-Stock

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Metaverse IC Inc.

Canada . 3,515 parts In-Stock

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Assy Fe

Spain . 3,515 parts In-Stock

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TANS Electronics

Latvia . 2,884 parts In-Stock

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Corphita

USA . 1,632 parts In-Stock

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Corohmni

South Africa . 239 parts In-Stock

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UHIMA Technologies

Türkiye . 54 parts In-Stock

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Overview

Elevate your consumer electronics with the LC72711LW-E by Onsemi, a top-tier manufacturer known for their cutting-edge technology and superior quality products. This versatile Other Function Consumer IC boasts a range of applications, providing endless possibilities for your electronic projects. With its high performance and reliability, this product offers exceptional value and benefits to customers seeking innovative solutions for their devices. Upgrade your designs with the LC72711LW-E and experience the advantages of Onsemi's expertise in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85 °C ensures stable performance even in challenging environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the product to function reliably in cold conditions.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish provides excellent solderability and long-term connection integrity, enhancing the overall quality of the product.

Width: 10 mm

The compact width of 10mm allows for space-efficient design and integration into various electronic devices.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement of 2.7V enables the product to operate efficiently even with limited power sources.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that the product is suitable for use in industrial settings where temperature fluctuations are common.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating ensures that the product has a low moisture absorption rate, making it suitable for storage and use in humid environments.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage tolerance of 3.6V provides flexibility in power supply options for the product.

Technical Specifications

Other Function Consumer ICs LC72711LW-E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e6

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

LC72711LW-E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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