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LC72717PW-NH

Onsemi

LC72717PW-NH by Onsemi

LC72717PW-NH by Onsemi is a 64-terminal consumer IC with CMOS technology. It operates b/w -40 to 85 °C, with Vsup ranging from 2.7V to 3.6V. This low-profile flatpack IC in plastic/epoxy package is ideal for industrial applications requiring fine-pitch terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,822 parts In-Stock

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Vyrian

USA . 345 parts In-Stock

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345

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Distributors (Availability)

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SupplyDigital Components

Austria . 5,001 parts In-Stock

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5,001

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Problanco Electronics

Mexico . 4,384 parts In-Stock

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4,384

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TANS Electronics

Latvia . 2,264 parts In-Stock

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Corphita

USA . 1,617 parts In-Stock

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UHIMA Technologies

Türkiye . 899 parts In-Stock

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899

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Kulean Microsystems

USA . 740 parts In-Stock

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Corohmni

South Africa . 138 parts In-Stock

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Overview

Experience top-notch quality and reliability with the LC72717PW-NH by Onsemi. This cutting-edge consumer IC boasts a sleek design and advanced technology, making it ideal for a wide range of applications. From smart home devices to automotive electronics, this versatile product offers unmatched performance and efficiency. Upgrade your projects today with the LC72717PW-NH and enjoy the benefits of superior craftsmanship and innovative features that only Onsemi can deliver. Unlock endless possibilities with this exceptional component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic circuits, making this IC suitable for modern manufacturing processes.

Package Shape: SQUARE

The square shape of the package allows for more efficient use of space on a circuit board, making it ideal for compact designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions, increasing its reliability.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures that the IC can function effectively in both low and high temperature environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC energy efficient and reliable in noisy environments.

Technical Specifications

Other Function Consumer ICs LC72717PW-NH attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

LC72717PW-NH General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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