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FJP5027N

Onsemi

FJP5027N by Onsemi

FJP5027N by Onsemi is a NPN power BJT transistor with max VCEsat of 2V, IC of 3A, and Pmax of 50W. Ideal for switching applications, it operates at up to 150 °C and has tf of 300ns.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,112 parts In-Stock

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Digiode

USA . 1,489 parts In-Stock

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Native Components

USA . 826 parts In-Stock

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$0.339

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$0.325

826

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$0.325

Northwest PG Solutions

USA . 2,011 parts In-Stock

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$0.373

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$0.329

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SupplyDigital Components

Austria . 8,363 parts In-Stock

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Problanco Electronics

Mexico . 7,207 parts In-Stock

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TANS Electronics

Latvia . 4,805 parts In-Stock

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Kulean Microsystems

USA . 3,908 parts In-Stock

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Corphita

USA . 3,013 parts In-Stock

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Supply Digital

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Corohmni

South Africa . 316 parts In-Stock

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UHIMA Technologies

Türkiye . 274 parts In-Stock

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Overview

Discover the power of the FJP5027N by Onsemi, a high-quality Power Bipolar Junction Transistor designed for efficient switching applications. Manufactured by Onsemi, a trusted leader in semiconductor technology, this NPN transistor offers reliable performance and durability. With a maximum collector-emitter voltage of 800V and a maximum power dissipation of 50W, this transistor is ideal for a wide range of electronic projects. Experience fast switching times and low saturation voltage with the FJP5027N, providing excellent value and performance for your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: NPN

Commonly used in digital and analog circuits, making it versatile for various applications.

Transistor Application: SWITCHING

Optimized for switching applications, providing fast response times and efficient operation.

Maximum Collector-Emitter Voltage: 800 V

Suitable for high voltage requirements, making it versatile for a wide range of applications.

Maximum Power Dissipation (Abs): 50 W

Capable of handling high power levels, ensuring reliability under heavy load conditions.

Minimum DC Current Gain (hFE): 10

Ensures consistent and stable amplification of input signals, improving overall performance.

Nominal Transition Frequency (fT): 15 MHz

High transition frequency allows for high-speed switching, suitable for fast-paced applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) FJP5027N attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

HIGH RELIABILITY

Maximum Collector Current (IC):

3 A

Maximum Collector-Emitter Voltage:

800 V

Configuration:

Minimum DC Current Gain (hFE):

10

Maximum Fall Time (tf):

300 ns

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum Turn Off Time (toff):

3300 ns

Maximum Turn On Time (ton):

500 ns

Maximum VCEsat:

2 V

Trade Compliance

FJP5027N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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