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FGAF20S65AQ

Onsemi

FGAF20S65AQ by Onsemi

FGAF20S65AQ by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.1V and IC of 40A. Ideal for general purpose switching applications, it has a turn-off time of 136ns and operates at temperatures ranging from -55 to 175°C.

Median Price

$1.870

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 130 parts In-Stock

1+ parts

$2.690

100+ parts

$2.130

1k+ parts

$1.620

10k+ parts

$1.250

130

$2.690

$2.130

$1.620

$1.250

Rochester

USA . 792,420 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.180

10k+ parts

$1.110

792,420

-

$1.320

$1.180

$1.110

DigiKey

USA . 787,710 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.520

10k+ parts

-

787,710

-

-

$1.520

-

Farnell

UK . 787,710 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.219

10k+ parts

-

787,710

-

-

$2.219

-

Flip Electronics (Authorized)

USA . 63,464 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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63,464

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,273 parts In-Stock

1+ parts

$1.387

100+ parts

-

1k+ parts

-

10k+ parts

-

2,273

$1.387

-

-

-

Vyrian

USA . 737 parts In-Stock

1+ parts

$1.520

100+ parts

-

1k+ parts

-

10k+ parts

-

737

$1.520

-

-

-

Flip Electronics

USA . 63,464 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

63,464

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 394 parts In-Stock

1+ parts

$0.756

100+ parts

-

1k+ parts

-

10k+ parts

-

394

$0.756

-

-

-

Northwest PG Solutions

USA . 565 parts In-Stock

1+ parts

$0.832

100+ parts

-

1k+ parts

-

10k+ parts

-

565

$0.832

-

-

-

Corphita

USA . 2,312 parts In-Stock

1+ parts

$1.314

100+ parts

-

1k+ parts

-

10k+ parts

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2,312

$1.314

-

-

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Component Stockers USA

USA . 888,043 parts In-Stock

1+ parts

$1.480

100+ parts

$1.380

1k+ parts

$1.260

10k+ parts

$1.260

888,043

$1.480

$1.380

$1.260

$1.260

Corohmni

South Africa . 129 parts In-Stock

1+ parts

$1.520

100+ parts

-

1k+ parts

-

10k+ parts

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129

$1.520

-

-

-

Microchip USA

USA . 203 parts In-Stock

1+ parts

$9.100

100+ parts

-

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-

10k+ parts

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203

$9.100

-

-

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Continental Prestige Electronics

USA . 598,230 parts In-Stock

1+ parts

-

100+ parts

$1.740

1k+ parts

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598,230

-

$1.740

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Perfect Parts

USA . 77,752 parts In-Stock

1+ parts

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100+ parts

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77,752

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Lixinc

USA . 17,041 parts In-Stock

1+ parts

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17,041

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SupplyDigital Components

Austria . 6,583 parts In-Stock

1+ parts

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6,583

-

-

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Kulean Microsystems

USA . 6,536 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,536

-

-

-

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TANS Electronics

Latvia . 5,213 parts In-Stock

1+ parts

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5,213

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-

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Problanco Electronics

Mexico . 3,647 parts In-Stock

1+ parts

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3,647

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-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,000

-

-

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UHIMA Technologies

Türkiye . 482 parts In-Stock

1+ parts

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482

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GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

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100+ parts

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50

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-

-

Overview

Upgrade your electronics with the FGAF20S65AQ by Onsemi, a top-quality Insulated Gate Bipolar Transistor designed for general purpose switching applications. With its N-channel configuration and built-in diode, this transistor offers superior performance and efficiency. Manufactured by Onsemi, a trusted name in the industry, you can trust in the reliability and durability of this product. Ideal for a wide range of applications, this transistor provides a maximum collector-emitter voltage of 650V and a maximum collector current of 40A, making it a valuable addition to any project. Experience the benefits of high-quality components with the FGAF20S65AQ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a long lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in the transistor, making it suitable for various applications.

Transistor Application: GENERAL PURPOSE SWITCHING

Versatile usage in different switching applications, making it a practical choice for a wide range of projects.

Maximum VCEsat: 2.1 V

Low saturation voltage results in minimal power loss and heat generation, increasing overall efficiency.

Nominal Turn Off Time (toff): 136 ns

Fast turn-off time allows for quick switching operations, improving performance and response time in applications.

Maximum Power Dissipation (Abs): 75 W

Can handle high power dissipation, making it suitable for applications that require substantial power output.

Maximum Operating Temperature: 175 °C

High temperature tolerance ensures reliable operation even in challenging environments.

Maximum Collector-Emitter Voltage: 650 V

Capable of handling high voltage levels, making it suitable for applications with higher voltage requirements.

Maximum Gate-Emitter Voltage: 20 V

Provides proper gating control and protection, preventing damage due to excessive voltage levels.

Minimum Operating Temperature: -55 °C

Can operate at low temperatures without compromising performance, suitable for a variety of environmental conditions.

Maximum Collector Current (IC): 40 A

Capable of handling high current levels, making it suitable for applications that require significant power output.

Nominal Turn On Time (ton): 29 ns

Fast turn-on time ensures quick activation and response, improving the efficiency of switching operations.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGAF20S65AQ attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

FAST SWITCHING

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.6 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

GENERAL PURPOSE SWITCHING

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

136 ns

Nominal Turn On Time (ton):

29 ns

Maximum VCEsat:

2.1 V

Trade Compliance

FGAF20S65AQ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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