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FGAF40N60UFD

Onsemi

FGAF40N60UFD by Onsemi

FGAF40N60UFD by Onsemi is an N-CHANNEL IGBT with 600V VCEsat, 40A IC, and 100W power dissipation. Ideal for motor control applications due to its fast turn-off time of 190ns and built-in diode configuration. Operates b/w -55 °C to 150°C temperature range in a rectangular package style.

Median Price

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Lifecycle Status

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3

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1k+

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Digiode

USA . 1,765 parts In-Stock

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Vyrian

USA . 1,060 parts In-Stock

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LittleDiode

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Andel Nordic

Denmark . 5,168 parts In-Stock

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$6.214

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$5.965

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Native Components

USA . 98 parts In-Stock

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$66.384

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Northwest PG Solutions

USA . 667 parts In-Stock

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$76.065

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A-Z Elektronik GmbH

Germany . 7,478 parts In-Stock

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Problanco Electronics

Mexico . 7,343 parts In-Stock

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SupplyDigital Components

Austria . 5,554 parts In-Stock

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Glotronic Ltd.

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TANS Electronics

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Corphita

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Supply Digital

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Alle Elektronik GmbH

Germany . 1,085 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 594 parts In-Stock

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Corohmni

South Africa . 239 parts In-Stock

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Assy Fe

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Overview

Discover the unbeatable performance and reliability of the FGAF40N60UFD by Onsemi, a top-tier manufacturer known for delivering high-quality Insulated Gate Bipolar Transistors (IGBT). Ideal for motor control applications, this N-channel transistor offers a single configuration with a built-in diode, ensuring seamless operation. With a maximum collector-emitter voltage of 600V and a maximum power dissipation of 100W, this IGBT guarantees efficient performance even in demanding environments. Elevate your projects with the FGAF40N60UFD and experience the value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material offers good insulation and protection for the internal components, ensuring durability and reliability.

Transistor Application: MOTOR CONTROL

Designed specifically for motor control applications, making it suitable for use in a wide range of industrial and automotive systems.

Maximum VCEsat: 3 V

Low VCEsat ensures reduced power loss and improved efficiency in operation.

Maximum Collector-Emitter Voltage: 600 V

High maximum collector-emitter voltage allows for use in high-voltage applications with a wide margin of safety.

Maximum Power Dissipation (Abs): 100 W

High power dissipation capability enables the transistor to handle high power loads without overheating.

Nominal Turn On Time (ton): 67 ns

Fast turn-on time allows for quick switching and efficient control of the motor, improving overall performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGAF40N60UFD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

250 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

450 ns

Nominal Turn Off Time (toff):

190 ns

Nominal Turn On Time (ton):

67 ns

Maximum VCEsat:

3 V

Trade Compliance

FGAF40N60UFD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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