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ESDM3051N2T5G

Onsemi

ESDM3051N2T5G by Onsemi

ESDM3051N2T5G by Onsemi is a single transient suppression device with 6.05V breakdown voltage, 0.1uA reverse current, and 8.2V clamping voltage. Ideal for protecting sensitive electronics from voltage spikes in applications like consumer electronics and industrial equipment.

Median Price

$0.100

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 15,614 parts In-Stock

1+ parts

$0.133

100+ parts

$0.128

1k+ parts

$0.124

10k+ parts

$0.063

15,614

$0.133

$0.128

$0.124

$0.063

DigiKey

USA . 977 parts In-Stock

1+ parts

$0.260

100+ parts

$0.119

1k+ parts

$0.092

10k+ parts

$0.074

977

$0.260

$0.119

$0.092

$0.074

Mouser Electronics

USA . 16,383 parts In-Stock

1+ parts

$0.300

100+ parts

$0.157

1k+ parts

$0.092

10k+ parts

$0.053

16,383

$0.300

$0.157

$0.092

$0.053

Flip Electronics (Authorized)

USA . 3,899,737 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,899,737

-

-

-

-

Rochester

USA . 94,390 parts In-Stock

1+ parts

-

100+ parts

$0.067

1k+ parts

$0.056

10k+ parts

$0.050

94,390

-

$0.067

$0.056

$0.050

Verical

USA . 91,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.062

91,390

-

-

-

$0.062

Chip1Stop

Japan . 1,300 parts In-Stock

1+ parts

-

100+ parts

$0.059

1k+ parts

$0.049

10k+ parts

-

1,300

-

$0.059

$0.049

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,936 parts In-Stock

1+ parts

$0.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,936

$0.050

-

-

-

Digiode

USA . 1,783 parts In-Stock

1+ parts

$0.052

100+ parts

-

1k+ parts

-

10k+ parts

-

1,783

$0.052

-

-

-

Flip Electronics

USA . 4,226,162 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,226,162

-

-

-

-

Ashlea Components Ltd

UK . 9,461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,461

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,604 parts In-Stock

1+ parts

$0.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,604

$0.050

-

-

-

Corohmni

South Africa . 193 parts In-Stock

1+ parts

$0.050

100+ parts

-

1k+ parts

-

10k+ parts

-

193

$0.050

-

-

-

Native Components

USA . 222 parts In-Stock

1+ parts

$0.278

100+ parts

-

1k+ parts

-

10k+ parts

$0.267

222

$0.278

-

-

$0.267

Northwest PG Solutions

USA . 1,771 parts In-Stock

1+ parts

$0.305

100+ parts

-

1k+ parts

-

10k+ parts

$0.269

1,771

$0.305

-

-

$0.269

Continental Prestige Electronics

USA . 248,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.066

10k+ parts

-

248,000

-

-

$0.066

-

Perfect Parts

USA . 28,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28,370

-

-

-

-

Kulean Microsystems

USA . 8,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,220

-

-

-

-

SupplyDigital Components

Austria . 6,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,625

-

-

-

-

Alle Elektronik GmbH

Germany . 5,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,115

-

-

-

-

Problanco Electronics

Mexico . 3,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,525

-

-

-

-

TANS Electronics

Latvia . 1,694 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,694

-

-

-

-

UHIMA Technologies

Türkiye . 574 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

574

-

-

-

-

Overview

Enhance the protection of your electronic devices with the ESDM3051N2T5G from Onsemi. As a leading manufacturer in the industry, Onsemi offers high-quality transient suppression devices that provide reliable safeguarding against voltage spikes and surges. Ideal for a wide range of applications, this single-config chip carrier is designed to efficiently protect your circuits with its bidirectional polarity and avalanche technology. With a nominal breakdown voltage of 6.05V and maximum clamping voltage of 8.2V, you can trust this product to deliver superior performance and durability. Invest in the ESDM3051N2T5G for peace of mind and assurance that your electronics are protected.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body offers durability and protection for the internal components of the device, making it reliable for long-term use.

Nominal Breakdown Voltage: 6.05 V

The nominal breakdown voltage of 6.05 V indicates the level at which the device will start conducting to suppress transient voltage spikes, providing effective protection for connected electronic components.

Maximum Power Dissipation: 0.25 W

With a maximum power dissipation of 0.25 W, this device can handle transient surges without getting damaged, ensuring continuous protection for sensitive electronics.

Reference Standard: IEC-61000-4-2, 4-5

Compliance with standards such as IEC-61000-4-2 and 4-5 ensures that the device meets industry requirements for transient suppression, guaranteeing its effectiveness in various applications.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The use of trans voltage suppressor diodes in this device allows for efficient clamping of transient voltage spikes, safeguarding connected circuits from potential damage.

Technical Specifications

Transient Suppression Devices ESDM3051N2T5G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE

Maximum Breakdown Voltage:

7 V

Minimum Breakdown Voltage:

5.1 V

Nominal Breakdown Voltage:

6.05 V

Maximum Clamping Voltage:

8.2 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N2

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity:

BIDIRECTIONAL

Maximum Power Dissipation:

.25 W

Reference Standard:

IEC-61000-4-2, 4-5

Maximum Repetitive Peak Reverse Voltage:

5 V

Maximum Reverse Current:

.1 uA

Reverse Test Voltage:

5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

ESDM3051N2T5G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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