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ESDM2033MX4T5G

Onsemi

ESDM2033MX4T5G by Onsemi

ESDM2033MX4T5G by Onsemi is a single bidirectional avalanche diode with 5V breakdown voltage, 0.1uA reverse current, and 6.5V clamping voltage. It is used for transient suppression in applications requiring protection against ESD events according to IEC-61000-4-2 standard.

Median Price

$0.200

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 18,914 parts In-Stock

1+ parts

$0.200

100+ parts

$0.058

1k+ parts

$0.051

10k+ parts

$0.040

18,914

$0.200

$0.058

$0.051

$0.040

Mouser Electronics

USA . 4,949 parts In-Stock

1+ parts

$0.200

100+ parts

$0.058

1k+ parts

$0.051

10k+ parts

$0.040

4,949

$0.200

$0.058

$0.051

$0.040

Chip1Stop

Japan . 2,450 parts In-Stock

1+ parts

$0.721

100+ parts

$0.147

1k+ parts

$0.090

10k+ parts

-

2,450

$0.721

$0.147

$0.090

-

Verical

USA . 710,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.035

710,000

-

-

-

$0.035

Rochester

USA . 564,866 parts In-Stock

1+ parts

-

100+ parts

$0.047

1k+ parts

$0.039

10k+ parts

$0.035

564,866

-

$0.047

$0.039

$0.035

EBV Elektronik

Germany . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 651 parts In-Stock

1+ parts

$0.037

100+ parts

-

1k+ parts

-

10k+ parts

-

651

$0.037

-

-

-

Vyrian

USA . 674 parts In-Stock

1+ parts

$0.039

100+ parts

-

1k+ parts

-

10k+ parts

-

674

$0.039

-

-

-

Flip Electronics

USA . 960,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

960,000

-

-

-

-

NAC Semi

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.196

10,000

-

-

-

$0.196

Cyclops Electronics Ltd

UK . 130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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130

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,736 parts In-Stock

1+ parts

$0.035

100+ parts

-

1k+ parts

-

10k+ parts

-

1,736

$0.035

-

-

-

Corohmni

South Africa . 214 parts In-Stock

1+ parts

$0.039

100+ parts

-

1k+ parts

-

10k+ parts

-

214

$0.039

-

-

-

Component Stockers USA

USA . 653,018 parts In-Stock

1+ parts

$0.040

100+ parts

$0.040

1k+ parts

$0.030

10k+ parts

$0.030

653,018

$0.040

$0.040

$0.030

$0.030

Native Components

USA . 439 parts In-Stock

1+ parts

$0.540

100+ parts

-

1k+ parts

-

10k+ parts

-

439

$0.540

-

-

-

Northwest PG Solutions

USA . 1,264 parts In-Stock

1+ parts

$0.594

100+ parts

-

1k+ parts

-

10k+ parts

-

1,264

$0.594

-

-

-

Perfect Parts

USA . 19,757 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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19,757

-

-

-

-

TANS Electronics

Latvia . 5,469 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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5,469

-

-

-

-

Authorized Procurement Solutions

USA . 4,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,850

-

-

-

-

Problanco Electronics

Mexico . 3,946 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,946

-

-

-

-

Kulean Microsystems

USA . 2,884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,884

-

-

-

-

GreenTree Electronics

Israel . 2,760 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,760

-

-

-

-

SupplyDigital Components

Austria . 1,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,022

-

-

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UHIMA Technologies

Türkiye . 920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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920

-

-

-

-

Overview

Protect your valuable electronic devices with the ESDM2033MX4T5G from Onsemi. As a leader in transient suppression devices, Onsemi ensures top-quality products that provide reliable protection against voltage spikes and surges. This single-config chip carrier is designed for surface mount applications, making it versatile for a wide range of industries. With a nominal breakdown voltage of 5V and maximum clamping voltage of 6.5V, this avalanche technology diode offers superior protection while maintaining efficient operation. Trust Onsemi to deliver the best quality solutions for your electronic protection needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the device lightweight and resistant to impacts, making it ideal for portable and rugged applications.

Nominal Breakdown Voltage: 5 V

With a nominal breakdown voltage of 5 V, this device can effectively protect against transient voltage spikes up to this level, ensuring the safety of connected components.

Maximum Reverse Current: 0.1 uA

The low maximum reverse current of 0.1 uA ensures minimal power loss and increases the efficiency of the device in suppressing transients.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures the device can withstand elevated temperatures without compromising its performance, making it suitable for a wide range of environments.

Reference Standard: IEC-61000-4-2

Compliance with the IEC-61000-4-2 standard ensures that the device meets industry requirements for transient suppression, guaranteeing its reliability and effectiveness.

Technical Specifications

Transient Suppression Devices ESDM2033MX4T5G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE

Maximum Breakdown Voltage:

6.5 V

Minimum Breakdown Voltage:

3.68 V

Nominal Breakdown Voltage:

5 V

Maximum Clamping Voltage:

6.5 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC-61000-4-2

Maximum Repetitive Peak Reverse Voltage:

3.3 V

Maximum Reverse Current:

.1 uA

Reverse Test Voltage:

3.3 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ESDM2033MX4T5G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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