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ESDM3051MXT5G

Onsemi

ESDM3051MXT5G by Onsemi

ESDM3051MXT5G by Onsemi is a single transient suppression device with 6.05V breakdown voltage, 0.1uA reverse current, and 8.2V clamping voltage. It is used for surge protection in applications requiring bidirectional polarity, such as IEC-61000-4-2 compliant systems.

Median Price

$0.050

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4,661 parts In-Stock

1+ parts

$0.042

100+ parts

-

1k+ parts

-

10k+ parts

-

4,661

$0.042

-

-

-

DigiKey

USA . 15,000 parts In-Stock

1+ parts

$0.310

100+ parts

$0.117

1k+ parts

$0.077

10k+ parts

$0.049

15,000

$0.310

$0.117

$0.077

$0.049

Rochester

USA . 4,690,000 parts In-Stock

1+ parts

-

100+ parts

$0.052

1k+ parts

$0.043

10k+ parts

$0.038

4,690,000

-

$0.052

$0.043

$0.038

Verical

USA . 4,690,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.048

4,690,000

-

-

-

$0.048

Flip Electronics (Authorized)

USA . 3,899,737 parts In-Stock

1+ parts

-

100+ parts

-

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3,899,737

-

-

-

-

Mouser Electronics

USA . 12,041 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.049

12,041

-

-

-

$0.049

Chip1Stop

Japan . 4,661 parts In-Stock

1+ parts

-

100+ parts

$0.083

1k+ parts

$0.056

10k+ parts

$0.051

4,661

-

$0.083

$0.056

$0.051

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,449 parts In-Stock

1+ parts

$0.041

100+ parts

-

1k+ parts

-

10k+ parts

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2,449

$0.041

-

-

-

Vyrian

USA . 479 parts In-Stock

1+ parts

$0.043

100+ parts

-

1k+ parts

-

10k+ parts

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479

$0.043

-

-

-

Rotakorn

Sweden . 4,544,854 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,544,854

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-

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Flip Electronics

USA . 4,219,712 parts In-Stock

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100+ parts

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4,219,712

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 174 parts In-Stock

1+ parts

$0.039

100+ parts

-

1k+ parts

-

10k+ parts

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174

$0.039

-

-

-

Corohmni

South Africa . 495 parts In-Stock

1+ parts

$0.043

100+ parts

-

1k+ parts

-

10k+ parts

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495

$0.043

-

-

-

Native Components

USA . 914 parts In-Stock

1+ parts

$5.150

100+ parts

-

1k+ parts

-

10k+ parts

-

914

$5.150

-

-

-

Continental Prestige Electronics

USA . 4,700,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.051

10k+ parts

-

4,700,000

-

-

$0.051

-

Infinite Electronics LLP (Excess)

. 31,300 parts In-Stock

1+ parts

-

100+ parts

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31,300

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-

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TANS Electronics

Latvia . 7,163 parts In-Stock

1+ parts

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7,163

-

-

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Problanco Electronics

Mexico . 5,612 parts In-Stock

1+ parts

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5,612

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,970 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,970

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-

-

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Kulean Microsystems

USA . 1,364 parts In-Stock

1+ parts

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100+ parts

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1,364

-

-

-

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Alle Elektronik GmbH

Germany . 1,313 parts In-Stock

1+ parts

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100+ parts

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1,313

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-

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Lixinc

USA . 518 parts In-Stock

1+ parts

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518

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Northwest PG Solutions

USA . 454 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$5.047

10k+ parts

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454

-

-

$5.047

-

SupplyDigital Components

Austria . 339 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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339

-

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UHIMA Technologies

Türkiye . 160 parts In-Stock

1+ parts

-

100+ parts

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160

-

-

-

-

Overview

Looking for reliable transient suppression devices? Look no further than the ESDM3051MXT5G by Onsemi. With a focus on quality and innovation, Onsemi delivers top-notch products like this one that guarantee superior performance and protection. Ideal for a variety of applications, this chip carrier style device offers customers peace of mind with its bidirectional polarity, low reverse current, and high clamping voltage. Trust Onsemi to provide the best in technology and value for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Nominal Breakdown Voltage: 6.05 V

The nominal breakdown voltage of 6.05 V ensures reliable protection against overvoltage conditions, making it suitable for a variety of electrical circuits.

Maximum Reverse Current: 0.1 uA

The low maximum reverse current of 0.1 uA indicates efficient suppression of reverse current flow, enhancing the overall performance and effectiveness of the device.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this transient suppression device can withstand elevated temperatures, making it suitable for use in demanding environments.

Reference Standard: IEC-61000-4-2, 4-5

Compliance with IEC standards ensures that the product meets industry requirements for transient suppression devices, providing assurance of quality and reliability.

Technical Specifications

Transient Suppression Devices ESDM3051MXT5G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE

Maximum Breakdown Voltage:

7 V

Minimum Breakdown Voltage:

5.1 V

Nominal Breakdown Voltage:

6.05 V

Maximum Clamping Voltage:

8.2 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N2

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity:

BIDIRECTIONAL

Maximum Power Dissipation:

.25 W

Reference Standard:

IEC-61000-4-2, 4-5

Maximum Repetitive Peak Reverse Voltage:

5 V

Maximum Reverse Current:

.1 uA

Reverse Test Voltage:

5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

ESDM3051MXT5G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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