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ESDM3031MXT5G

Onsemi

ESDM3031MXT5G by Onsemi

ESDM3031MXT5G by Onsemi is a single bidirectional Trans Voltage Suppressor Diode with 3.3V reverse test voltage, 20pF diode capacitance, and 8V clamping voltage. It is used for transient suppression in electronic circuits to protect against voltage spikes and surges.

Median Price

$0.052

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 19,354 parts In-Stock

1+ parts

$0.143

100+ parts

$0.052

1k+ parts

$0.029

10k+ parts

$0.025

19,354

$0.143

$0.052

$0.029

$0.025

DigiKey

USA . 8,713 parts In-Stock

1+ parts

$0.310

100+ parts

$0.117

1k+ parts

$0.077

10k+ parts

$0.059

8,713

$0.310

$0.117

$0.077

$0.059

Farnell

UK . 10,580,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.051

10,580,000

-

-

-

$0.051

Rochester

USA . 10,404,418 parts In-Stock

1+ parts

-

100+ parts

$0.052

1k+ parts

$0.043

10k+ parts

$0.038

10,404,418

-

$0.052

$0.043

$0.038

Verical

USA . 10,280,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.048

10,280,000

-

-

-

$0.048

Flip Electronics (Authorized)

USA . 140,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

140,000

-

-

-

-

Chip1Stop

Japan . 19,350 parts In-Stock

1+ parts

-

100+ parts

$0.079

1k+ parts

$0.044

10k+ parts

$0.041

19,350

-

$0.079

$0.044

$0.041

Mouser Electronics

USA . 16,277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.049

16,277

-

-

-

$0.049

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 552 parts In-Stock

1+ parts

$0.041

100+ parts

-

1k+ parts

-

10k+ parts

-

552

$0.041

-

-

-

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$0.070

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$0.070

-

-

-

Vyrian

USA . 3,930,486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,930,486

-

-

-

-

Flip Electronics

USA . 140,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

140,000

-

-

-

-

Bristol Electronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$0.113

1k+ parts

$0.068

10k+ parts

$0.034

10,000

-

$0.113

$0.068

$0.034

Dan-Mar Components

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

NexGen Digital

USA . 1,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,526

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,930,921 parts In-Stock

1+ parts

$0.037

100+ parts

-

1k+ parts

-

10k+ parts

-

3,930,921

$0.037

-

-

-

Semicontronic

India . 3,930,565 parts In-Stock

1+ parts

$0.037

100+ parts

$0.036

1k+ parts

$0.036

10k+ parts

-

3,930,565

$0.037

$0.036

$0.036

-

Corphita

USA . 1,071 parts In-Stock

1+ parts

$0.039

100+ parts

-

1k+ parts

-

10k+ parts

-

1,071

$0.039

-

-

-

Corohmni

South Africa . 112 parts In-Stock

1+ parts

$0.043

100+ parts

-

1k+ parts

-

10k+ parts

-

112

$0.043

-

-

-

Argo Parts USA

USA . 1,076 parts In-Stock

1+ parts

$0.070

100+ parts

-

1k+ parts

-

10k+ parts

$0.068

1,076

$0.070

-

-

$0.068

Aztec Data Supply Inc.

USA . 4,138 parts In-Stock

1+ parts

$0.080

100+ parts

-

1k+ parts

-

10k+ parts

-

4,138

$0.080

-

-

-

Continental Prestige Electronics

USA . 10,580,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.051

10k+ parts

-

10,580,000

-

-

$0.051

-

Perfect Parts

USA . 89,432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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89,432

-

-

-

-

TANS Electronics

Latvia . 7,469 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,469

-

-

-

-

SupplyDigital Components

Austria . 5,440 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,440

-

-

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-

Problanco Electronics

Mexico . 5,202 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,202

-

-

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Kulean Microsystems

USA . 1,189 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,189

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-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.069

1k+ parts

$0.067

10k+ parts

$0.065

500

-

$0.069

$0.067

$0.065

UHIMA Technologies

Türkiye . 157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

157

-

-

-

-

Overview

Enhance the reliability of your electronic devices with the ESDM3031MXT5G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Transient Suppression Devices that provide superior protection against voltage spikes and surges. Ideal for a wide range of applications, this product ensures optimal performance and longevity for your electronics. Experience peace of mind knowing that your devices are safeguarded with the ESDM3031MXT5G, offering value, benefits, and advantages that exceed expectations. Trust Onsemi to deliver the highest standard in transient suppression technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability of the product, making it suitable for a wide range of applications.

Config: SINGLE

Single configuration simplifies installation and maintenance, reducing overall complexity of the system.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Reverse Current: 0.1 uA

Low maximum reverse current ensures efficient operation and protection against transient voltage spikes.

Package Shape: RECTANGULAR

Rectangular package shape offers ease of handling and installation in various electronic devices.

Reverse Test Voltage: 3.3 V

Reverse test voltage of 3.3V indicates the level of protection offered against reverse polarity and transient voltage events.

No. of Terminals: 2

Only two terminals simplify installation and reduce the chance of wiring errors.

Package Style (Meter): CHIP CARRIER

Chip carrier package style enables compact and efficient design, suitable for modern devices with limited space.

Maximum Operating Temperature: 150 °C

High maximum operating temperature makes this product suitable for use in various environments and conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures reliable operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and installation onto PCBs.

Maximum Power Dissipation: 0.25 W

High maximum power dissipation capability allows for reliable performance under varying load conditions.

Minimum Breakdown Voltage: 4.4 V

High minimum breakdown voltage provides effective protection against voltage surges and spikes.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature ensures minimal heat exposure during assembly processes, preventing damage to the device.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables efficient soldering processes without compromising the device's performance.

Maximum Breakdown Voltage: 6.2 V

High maximum breakdown voltage ensures reliable protection against voltage transients within the specified range.

Reference Standard: IEC-61000-4-2

Compliance with IEC standards ensures that the product meets industry requirements for transient suppression devices.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The diode type specifically designed for transient voltage suppression provides effective protection against voltage spikes and surges.

Technology: AVALANCHE

Avalanche technology offers superior transient voltage suppression capabilities, providing reliable protection for connected devices.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of soldering defects and ensures a secure electrical connection.

Maximum Repetitive Peak Reverse Voltage: 3.3 V

High maximum repetitive peak reverse voltage ensures continuous protection against reverse polarity events.

Polarity: BIDIRECTIONAL

Bidirectional polarity allows the device to protect against both positive and negative transient voltage events effectively.

Minimum Diode Capacitance: 20 pF

Low minimum diode capacitance ensures fast response time to transient voltage events, offering quick protection for connected devices.

Maximum Clamping Voltage: 8 V

High maximum clamping voltage ensures that connected devices are protected within a safe voltage range during transient events.

Diode Element Material: SILICON

Silicon as the diode element material provides high reliability and performance in transient suppression applications.

Technical Specifications

Transient Suppression Devices ESDM3031MXT5G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE, ULTRA LOW CAPACITANCE

Maximum Breakdown Voltage:

6.2 V

Minimum Breakdown Voltage:

4.4 V

Maximum Clamping Voltage:

8 V

Config:

SINGLE

Minimum Diode Capacitance:

20 pF

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N2

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity:

BIDIRECTIONAL

Maximum Power Dissipation:

.25 W

Reference Standard:

IEC-61000-4-2

Maximum Repetitive Peak Reverse Voltage:

3.3 V

Maximum Reverse Current:

.1 uA

Reverse Test Voltage:

3.3 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ESDM3031MXT5G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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