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CPH3461-TL-W

Onsemi

CPH3461-TL-W by Onsemi

CPH3461-TL-W by Onsemi is a N-CHANNEL FET with 250V DS Breakdown Voltage, 0.35A Drain Current, and 7.2 ohm On Resistance. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a RECTANGULAR package suitable for surface mount technology. Operating at up to 150 °C, this MOSFET has GULL WING terminals and TIN BISMUTH finish.

Median Price

$0.122

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 783,756 parts In-Stock

1+ parts

-

100+ parts

$0.127

1k+ parts

$0.106

10k+ parts

$0.094

783,756

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$0.127

$0.106

$0.094

Verical

USA . 783,750 parts In-Stock

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$0.118

783,750

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$0.118

Distributors (In-Stock)

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Digiode

USA . 861 parts In-Stock

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$0.120

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861

$0.120

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Chip Stock

USA . 102,500 parts In-Stock

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Flip Electronics

USA . 57,000 parts In-Stock

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Vyrian

USA . 12,400 parts In-Stock

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ComSIT Distribution GmbH

Germany . 746 parts In-Stock

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Cyclops Electronics Ltd

UK . 400 parts In-Stock

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400

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Distributors (Availability)

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Corphita

USA . 1,948 parts In-Stock

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$0.113

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1,948

$0.113

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Corohmni

South Africa . 108 parts In-Stock

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$0.126

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108

$0.126

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Continental Prestige Electronics

USA . 710 parts In-Stock

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$0.342

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$0.140

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$0.105

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710

$0.342

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$0.105

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Native Components

USA . 170 parts In-Stock

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$0.673

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170

$0.673

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Northwest PG Solutions

USA . 240 parts In-Stock

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$0.740

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$0.740

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Component Stockers USA

USA . 69,443 parts In-Stock

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$2.320

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$2.200

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$2.130

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$0.110

69,443

$2.320

$2.200

$2.130

$0.110

AZTECH Wire

Italy . 1,161 parts In-Stock

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$15.230

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Perfect Parts

USA . 115,685 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Eastek

USA . 72,000 parts In-Stock

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$0.120

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GreenTree Electronics

Israel . 72,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,401 parts In-Stock

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Infinite Electronics LLP (Excess)

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Futuretech Components

Singapore . 8,000 parts In-Stock

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TANS Electronics

Latvia . 5,833 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 1,166 parts In-Stock

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Kulean Microsystems

USA . 775 parts In-Stock

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UHIMA Technologies

Türkiye . 319 parts In-Stock

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Problanco Electronics

Mexico . 238 parts In-Stock

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Overview

Enhance your electronic designs with the CPH3461-TL-W Small Signal Field Effect Transistor by Onsemi. Known for their high-quality components, Onsemi delivers reliable and efficient solutions for switching applications. With a minimum DS Breakdown Voltage of 250V and a maximum Drain Current of 0.35A, this N-CHANNEL transistor offers superior performance in a compact package. Whether you're designing consumer electronics or industrial equipment, the CPH3461-TL-W provides value, efficiency, and peace of mind. Upgrade your designs today with Onsemi's trusted technology.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to external factors, ensuring a longer product lifespan.

Polarity or Channel Type N-CHANNEL

N-CHANNEL configuration allows for efficient switching in electronic circuits, making it suitable for various applications.

Transistor Application SWITCHING

Designed specifically for switching applications, ensuring reliable performance and fast response times.

Surface Mount YES

Surface mount capability makes it easy to integrate into circuit boards, saving space and simplifying manufacturing processes.

Minimum DS Breakdown Voltage 250 V

With a high breakdown voltage, this transistor can handle higher voltages without breaking down, ensuring robust performance in diverse applications.

Operating Mode ENHANCEMENT MODE

Enhancement mode operation offers improved control over the transistor's behavior, enhancing overall performance in various operating conditions.

Maximum Drain Current (Abs) (ID) 0.35 A

Capable of handling a maximum drain current of 0.35 A, this transistor is suitable for low to medium power applications.

Maximum Power Dissipation (Abs) 1 W

With a maximum power dissipation of 1 W, this transistor can effectively dissipate heat and operate efficiently in demanding conditions.

Maximum Operating Temperature 150 °C

The ability to operate at temperatures up to 150 °C ensures reliable performance even in high-temperature environments.

Maximum Drain-Source On Resistance 7.2 ohm

Low drain-source resistance of 7.2 ohms minimizes power loss and improves overall efficiency in circuit applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) CPH3461-TL-W attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

.35 A

Maximum Drain Current (ID):

.35 A

Maximum Drain-Source On Resistance:

7.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CPH3461-TL-W Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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