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BS107ARLRE

Onsemi

BS107ARLRE by Onsemi

BS107ARLRE by Onsemi is a N-CHANNEL FET with 200V DS Breakdown Voltage. It is used for SWITCHING applications, featuring SINGLE configuration with BUILT-IN DIODE. With 6.4 ohm RDS(on) and 0.25A ID, it operates in ENHANCEMENT MODE at up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,777 parts In-Stock

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1,777

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Digiode

USA . 1,060 parts In-Stock

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1,060

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Distributors (Availability)

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Native Components

USA . 145 parts In-Stock

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$0.381

100+ parts

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$0.366

145

$0.381

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$0.366

Northwest PG Solutions

USA . 2,062 parts In-Stock

1+ parts

$0.419

100+ parts

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$0.370

2,062

$0.419

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$0.370

Problanco Electronics

Mexico . 5,999 parts In-Stock

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5,999

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Kulean Microsystems

USA . 5,219 parts In-Stock

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5,219

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TANS Electronics

Latvia . 2,370 parts In-Stock

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2,370

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Corphita

USA . 2,287 parts In-Stock

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2,287

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SupplyDigital Components

Austria . 1,434 parts In-Stock

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1,434

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UHIMA Technologies

Türkiye . 768 parts In-Stock

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768

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Corohmni

South Africa . 60 parts In-Stock

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60

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Overview

Experience top-notch quality and reliability with the BS107ARLRE by Onsemi, a leading manufacturer in the industry. This Small Signal Field Effect Transistor (FET) is perfect for various switching applications, offering unrivaled performance and durability. With a built-in diode and an operating temperature of up to 150 °C, this transistor ensures seamless operation even in demanding environments. Trust Onsemi to deliver innovative solutions that exceed your expectations and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the transistor, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility and faster switching speeds, making them ideal for high-frequency switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling and protection against reverse current flow, enhancing the overall performance of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can handle rapid changes in voltage and current with minimal distortion.

Minimum DS Breakdown Voltage: 200 V

With a high breakdown voltage, this transistor can withstand higher voltage levels, ensuring reliable operation in high-power circuits.

Package Shape: ROUND

The round package shape allows for easy mounting and soldering onto circuit boards, saving time and effort during assembly.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure and stable connections, reducing the risk of connectivity issues and ensuring consistent performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer precise control over the switching behavior, enabling efficient operation and optimal power management.

No. of Terminals: 3

The three terminals provide the necessary connections for proper operation and control of the transistor in various circuit configurations.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers a compact and space-saving design, making it suitable for applications where size constraints are a concern.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance and reliability, making this transistor an excellent choice for demanding applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperature environments, ensuring stable performance under various conditions.

Transistor Element Material: SILICON

Silicon transistors offer excellent electrical properties and reliability, making them a preferred choice for a wide range of electronic applications.

Terminal Finish: TIN LEAD

The tin lead finish on the terminals provides good conductivity and solderability, ensuring secure connections and reliable performance in circuits.

Maximum Drain Current (ID): 0.25 A

Capable of handling a maximum drain current of 0.25A, this transistor is suitable for low to medium power applications where efficient current handling is required.

Maximum Drain-Source On Resistance: 6.4 ohm

With a low drain-source on resistance, this transistor offers efficient conduction and minimal power loss, enhancing overall circuit performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy installation and connection in circuit designs, ensuring a hassle-free integration process.

Technical Specifications

Small Signal Field Effect Transistors (FET) BS107ARLRE attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

.25 A

Maximum Drain-Source On Resistance:

6.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BS107ARLRE Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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