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BS107G

Onsemi

BS107G by Onsemi

BS107G by Onsemi is a N-CHANNEL FET with 200V DS Breakdown Voltage, ideal for SWITCHING applications. It features 0.25A Drain Current, 14 ohm On Resistance, and operates in ENHANCEMENT MODE. The PLASTIC/EPOXY package has a ROUND shape with THROUGH-HOLE terminals, suitable for various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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LWI Electronics Inc

India . 990 parts In-Stock

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990

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Digiode

USA . 282 parts In-Stock

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282

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Vyrian

USA . 228 parts In-Stock

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Native Components

USA . 27 parts In-Stock

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$0.421

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$0.404

27

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Northwest PG Solutions

USA . 1,112 parts In-Stock

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$0.463

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$0.408

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$0.463

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$0.408

Component Stockers USA

USA . 207 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 26,979 parts In-Stock

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SupplyDigital Components

Austria . 5,360 parts In-Stock

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TANS Electronics

Latvia . 5,314 parts In-Stock

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Kulean Microsystems

USA . 4,293 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Problanco Electronics

Mexico . 2,690 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Corphita

USA . 1,475 parts In-Stock

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UHIMA Technologies

Türkiye . 698 parts In-Stock

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Corohmni

South Africa . 367 parts In-Stock

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Overview

Enhance your electronic projects with the BS107G Small Signal Field Effect Transistor by Onsemi. This high-quality N-CHANNEL transistor offers reliable performance in switching applications, providing a maximum drain current of 0.25A and a minimum breakdown voltage of 200V. With a durable plastic/epoxy package body and a built-in diode, this transistor is designed for convenience and efficiency. Trust Onsemi's expertise in semiconductor technology to deliver a product that meets your needs and exceeds your expectations. Upgrade your circuits with the BS107G and experience the benefits of enhanced power management and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, ensuring longevity and reliability in various environments.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have lower on-state resistance and higher efficiency, making them suitable for various switching applications.

Minimum DS Breakdown Voltage: 200 V

Capable of handling high voltage applications, making it suitable for use in power circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides reverse voltage protection and can simplify circuit design in certain applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast switching speeds and high efficiency.

Maximum Drain Current (Abs): 0.25 A

Capable of handling moderate current levels, suitable for low to medium power applications.

Maximum Power Dissipation (Abs): 0.35 W

Efficient power dissipation characteristics, ensuring the transistor stays within safe operating temperatures.

Maximum Operating Temperature: 150 °C

Can operate in high temperature environments without compromising performance or reliability.

Maximum Drain-Source On Resistance: 14 ohm

Low on-state resistance leads to reduced power loss and improved efficiency in switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BS107G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

.25 A

Maximum Drain Current (ID):

.25 A

Maximum Drain-Source On Resistance:

14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-226AA

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BS107G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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