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BS107A

Onsemi

BS107A by Onsemi

BS107A by Onsemi is a N-CHANNEL FET with 200V DS breakdown voltage, 0.25A max drain current, and 6.4 ohm max on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.6W. Its cylindrical package shape and through-hole terminals make it suitable for various electronic designs.

Median Price

$1.030

Lifecycle Status

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18

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Ace Electronics

USA . 9 parts In-Stock

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Nova Conductors

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Infinite Electronics LLP

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J2 Sourcing AB

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Zilex Electronics Inc.

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ECAB

Sweden . 65 parts In-Stock

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Prism Electronics

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GES GmbH

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Sensible Micro Corp

USA . 7 parts In-Stock

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LWI Electronics Inc

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Resion

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Corohmni

South Africa . 395 parts In-Stock

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AZTECH Wire

Italy . 491 parts In-Stock

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One Stop Electronics

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Lixinc

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Kulean Microsystems

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Corphita

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Continental Prestige Electronics

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UNI Independent Distributors

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SupplyDigital Components

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Argo Parts USA

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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TANS Electronics

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Bastille Electronics

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Problanco Electronics

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Overview

Unlock the potential of your electronic devices with the Onsemi BS107A Small Signal Field Effect Transistor (FET). Manufactured by industry leader Onsemi, this N-CHANNEL transistor offers superior quality and reliability. Ideal for switching applications, this transistor provides efficient performance and enhanced functionality. With a maximum operating temperature of 150°C and a minimum DS Breakdown Voltage of 200V, the BS107A delivers outstanding power dissipation capabilities. Upgrade your electronics with the BS107A and experience the difference in quality and performance today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a variety of environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better conductivity and lower resistance, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, adding an extra layer of reliability to the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Minimum DS Breakdown Voltage: 200 V

With a high minimum breakdown voltage, this transistor can handle higher voltages without damage, increasing its versatility.

Maximum Drain Current (Abs) (ID): 0.25 A

Capable of handling a maximum drain current of 0.25 A, suitable for many low-power applications.

Maximum Power Dissipation (Abs): 0.6 W

With a maximum power dissipation of 0.6 W, the transistor can handle moderate power levels efficiently.

Maximum Drain-Source On Resistance: 6.4 ohm

Low drain-source on resistance leads to lower power dissipation and improved efficiency in switching operations.

Maximum Operating Temperature: 150 °C

Can operate at temperatures up to 150°C, suitable for a wide range of industrial applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved reliability, efficiency, and performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) BS107A attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

.25 A

Maximum Drain Current (ID):

.25 A

Maximum Drain-Source On Resistance:

6.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-226AA

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BS107A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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