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BS107ARLRA

Onsemi

BS107ARLRA by Onsemi

BS107ARLRA by Onsemi is a N-CHANNEL FET with 200V DS breakdown voltage. Ideal for switching applications, it features a single configuration with built-in diode and operates in enhancement mode. With max ID of 0.25A and RDS(on) of 6.4 ohm, this transistor has a max temp rating of 150 °C suitable for various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,319 parts In-Stock

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Digiode

USA . 2,177 parts In-Stock

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Native Components

USA . 496 parts In-Stock

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$20.584

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Northwest PG Solutions

USA . 1,335 parts In-Stock

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$22.643

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$20.378

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SupplyDigital Components

Austria . 7,056 parts In-Stock

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Kulean Microsystems

USA . 6,064 parts In-Stock

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Problanco Electronics

Mexico . 2,808 parts In-Stock

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Corphita

USA . 2,248 parts In-Stock

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TANS Electronics

Latvia . 690 parts In-Stock

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UHIMA Technologies

Türkiye . 562 parts In-Stock

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Corohmni

South Africa . 357 parts In-Stock

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Overview

Enhance your electronic projects with the BS107ARLRA Small Signal Field Effect Transistor (FET) from Onsemi. Known for their high-quality components, Onsemi delivers reliable and durable products that meet the demands of various applications. Ideal for switching purposes, this N-CHANNEL transistor offers a single configuration with a built-in diode, providing convenience and efficiency in circuit design. With a minimum DS Breakdown Voltage of 200V and an operating temperature of up to 150 °C, the BS107ARLRA ensures optimal performance under challenging conditions. Trust Onsemi for superior FET technology that delivers value, benefits, and advantages to customers seeking top-notch electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics compared to P-channel transistors, making this product a good choice for efficient switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in various electronic circuits.

Minimum DS Breakdown Voltage: 200 V

With a high breakdown voltage, this transistor can handle higher voltages, making it suitable for applications requiring high voltage switching.

Package Shape: ROUND

The round package shape allows for easy installation and integration into electronic circuits.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are easier to control and operate, providing more precise switching capabilities.

No. of Terminals: 3

With three terminals, this transistor can be easily connected in a circuit for efficient signal processing.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and low power consumption, making this transistor ideal for energy-efficient applications.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures, ensuring reliability even in challenging environmental conditions.

Transistor Element Material: SILICON

Silicon is a commonly used semiconductor material known for its electrical properties, making this transistor a reliable choice for electronic circuits.

Terminal Finish: TIN LEAD

Tin lead finish provides good conductivity and solderability, ensuring secure connections in the circuit.

Maximum Drain Current (ID): 0.25 A

Capable of handling a maximum drain current of 0.25 A, suitable for low to moderate power applications.

Maximum Drain-Source On Resistance: 6.4 ohm

With a low drain-source on resistance, this transistor offers efficient current flow and minimal power loss.

Terminal Position: BOTTOM

Bottom terminal position makes it easy to mount and solder the transistor onto a circuit board for seamless integration.

Technical Specifications

Small Signal Field Effect Transistors (FET) BS107ARLRA attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

.25 A

Maximum Drain-Source On Resistance:

6.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BS107ARLRA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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