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BS107ARL1G

Onsemi

BS107ARL1G by Onsemi

BS107ARL1G by Onsemi is a N-CHANNEL FET with 200V DS Breakdown Voltage. It's used for SWITCHING applications, operating in ENHANCEMENT MODE with 0.25A Drain Current. The transistor has a Max Power Dissipation of 0.35W and Max Operating Temperature of 150°C.

Median Price

$1.605

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 25 parts In-Stock

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$0.131

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25

$0.131

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Component Electronics Inc.

Canada . 19 parts In-Stock

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$3.080

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$2.310

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$2.000

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19

$3.080

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$2.000

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Chip Stock

USA . 8,755 parts In-Stock

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Vyrian

USA . 5,974 parts In-Stock

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Digiode

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VNN

France . 924 parts In-Stock

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NPI Materials, Inc.

USA . 26 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 25 parts In-Stock

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Kiltronic GmbH

Germany . 20 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 290 parts In-Stock

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$0.126

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$0.126

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Aranea Global

USA . 100 parts In-Stock

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$0.128

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$0.123

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100

$0.128

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Continental Prestige Electronics

USA . 4,180 parts In-Stock

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$0.131

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Argo Parts USA

USA . 3,602 parts In-Stock

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Benley Electronics

USA . 45 parts In-Stock

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$0.300

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$1.239

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$1.127

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$1.016

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200

$1.239

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$1.016

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AZTECH Wire

Italy . 306 parts In-Stock

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$8.894

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Ampacity Inc.

Singapore . 667 parts In-Stock

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$23.050

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QUARKTWIN TECHNOLOGY LTD

USA . 18,566 parts In-Stock

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SupplyDigital Components

Austria . 8,240 parts In-Stock

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Metaverse IC Inc.

Canada . 8,000 parts In-Stock

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TANS Electronics

Latvia . 7,353 parts In-Stock

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Problanco Electronics

Mexico . 6,850 parts In-Stock

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Kepictronics

USA . 4,140 parts In-Stock

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Kulean Microsystems

USA . 3,841 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Perfect Parts

USA . 1,121 parts In-Stock

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Corphita

USA . 1,097 parts In-Stock

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UHIMA Technologies

Türkiye . 233 parts In-Stock

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Overview

Discover the power of the BS107ARL1G by Onsemi, a top-quality small signal Field Effect Transistor that offers unparalleled performance and reliability. Manufactured by Onsemi, a leader in semiconductor technology, this N-CHANNEL transistor is ideal for switching applications, providing enhanced efficiency and precision. With a built-in diode and a maximum DS Breakdown Voltage of 200V, this transistor guarantees optimal functionality. Trust in Onsemi's expertise and elevate your projects with the BS107ARL1G, delivering unrivaled value and benefits to customers seeking high-performance components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable package material, suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have better performance characteristics compared to P-Channel, making this product a good choice for applications requiring high efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps in protecting the circuit from reverse voltage spikes, enhancing the overall reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient ON/OFF transitions.

Minimum DS Breakdown Voltage: 200 V

High breakdown voltage allows for operating in high voltage environments without risk of damage.

Maximum Power Dissipation (Abs): 0.35 W

Low power dissipation ensures minimal heat generation during operation, making it suitable for compact designs.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Maximum Drain-Source On Resistance: 6.4 ohm

Low on-resistance ensures efficient current flow, leading to minimal power loss and high performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) BS107ARL1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

.25 A

Maximum Drain Current (ID):

.25 A

Maximum Drain-Source On Resistance:

6.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-226AA

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BS107ARL1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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