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BS107ARLRM

Onsemi

BS107ARLRM by Onsemi

BS107ARLRM by Onsemi is a N-CHANNEL FET with 200V DS Breakdown Voltage. It is used for SWITCHING applications, featuring 0.25A Drain Current and 6.4 ohm On Resistance. The transistor operates in ENHANCEMENT MODE with a max temperature of 150 °C.

Median Price

$1.343

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 56 parts In-Stock

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$1.343

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Vyrian

USA . 2,299 parts In-Stock

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2,299

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Digiode

USA . 1,146 parts In-Stock

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Native Components

USA . 448 parts In-Stock

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$0.781

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Northwest PG Solutions

USA . 713 parts In-Stock

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$0.859

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713

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TANS Electronics

Latvia . 6,196 parts In-Stock

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Problanco Electronics

Mexico . 4,654 parts In-Stock

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SupplyDigital Components

Austria . 2,382 parts In-Stock

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Kulean Microsystems

USA . 1,807 parts In-Stock

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Corphita

USA . 1,430 parts In-Stock

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UHIMA Technologies

Türkiye . 566 parts In-Stock

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Corohmni

South Africa . 180 parts In-Stock

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Overview

Enhance your electronic projects with the BS107ARLRM Small Signal Field Effect Transistor by Onsemi. Known for their superior quality and reliability, Onsemi delivers top-notch products that exceed industry standards. This N-CHANNEL FET is perfect for switching applications, offering a maximum drain current of 0.25 A and a minimum DS breakdown voltage of 200 V. With its built-in diode configuration and cylindrical package shape, this transistor ensures optimal performance and efficiency. Trust Onsemi to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching operations and compatibility with a wide range of circuitry.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by incorporating a diode within the transistor, reducing the need for additional components.

Transistor Application: SWITCHING

Optimized for fast switching applications, making it suitable for a variety of electronic devices.

Minimum DS Breakdown Voltage: 200 V

Provides a high level of voltage protection, ensuring the transistor can handle a wide range of voltage requirements.

Operating Mode: ENHANCEMENT MODE

Allows for easy control of the transistor's conductivity, enhancing overall performance in switching applications.

Maximum Drain Current (Abs): 0.25 A

Delivers sufficient current handling capacity for various switching tasks, improving overall efficiency.

Maximum Power Dissipation (Abs): 0.35 W

Efficiently dissipates heat to prevent overheating and maintain stable operation under high power conditions.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures without compromising performance, ensuring reliability in diverse operating environments.

Maximum Drain-Source On Resistance: 6.4 ohm

Features low resistance for efficient current flow, enhancing the transistor's overall switching capabilities.

Technical Specifications

Small Signal Field Effect Transistors (FET) BS107ARLRM attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

.25 A

Maximum Drain Current (ID):

.25 A

Maximum Drain-Source On Resistance:

6.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-226AA

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BS107ARLRM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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