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BS107

Onsemi

BS107 by Onsemi

BS107 by Onsemi is a N-CHANNEL FET with 200V DS Breakdown Voltage. It has 0.25A ID, 14 ohm RDS(on), and operates in ENHANCEMENT MODE for SWITCHING applications. The transistor comes in a ROUND package with PLASTIC/EPOXY body material and can handle up to 1W power dissipation at 150 °C.

Median Price

$3.300

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

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TEDSS.com

USA . 2,000 parts In-Stock

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$1.050

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$0.560

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American Microsemiconductor Inc.

USA . 390 parts In-Stock

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J2 Sourcing AB

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ACDS - Activité Composants Distribution Service

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Freddi Giovanni

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Bristol Electronics

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Digiode

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ComSIT Distribution GmbH

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Corel Iberica Componentes, S.L.

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Electronic Expediters

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Fibra_Brandt Electronic GMBH

Germany . 2,312 parts In-Stock

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Tech-Mark Corp

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ECAB

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Atlantic Semiconductor

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Anansix

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GES GmbH

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Lakeview Electronics

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Mil-Aero Solutions, Inc.

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Lakeland Logistics Inc

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Century Electronics Ltd.

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Pegasus Components GmbH

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Speed Components Ltd

Israel . 203 parts In-Stock

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LittleDiode

UK . 172 parts In-Stock

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MISTER SPROCKETS

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Vyrian

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Huijzer Components

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Sinequanon

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Component Sense

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Elcom Components

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Distributors (Availability)

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$0.539

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Corohmni

South Africa . 259 parts In-Stock

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Modulus Dynamics

Lithuania . 13,389 parts In-Stock

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One Stop Electronics

USA . 769 parts In-Stock

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Problanco Electronics

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SupplyDigital Components

Austria . 4,700 parts In-Stock

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Northwest PG Solutions

USA . 3,415 parts In-Stock

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Corphita

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Kulean Microsystems

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TANS Electronics

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Infinite Electronics LLP (Excess)

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Native Components

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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UNI Independent Distributors

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UHIMA Technologies

Türkiye . 146 parts In-Stock

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S.R.D Solutions

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Overview

Discover the BS107 by Onsemi, a high-quality Small Signal Field Effect Transistor that offers incredible value and performance. With Onsemi's reputation for excellence in semiconductor manufacturing, this N-CHANNEL transistor is perfect for switching applications. Its single configuration with a built-in diode ensures efficient operation, while the 200V minimum DS breakdown voltage provides reliability. Whether you're looking to enhance your electronic projects or streamline your circuit design, the BS107 delivers the power, efficiency, and versatility you need. Upgrade your electronics with the BS107 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, ensuring reliable performance and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel type transistors typically have better performance characteristics and lower on-resistance compared to P-channel types.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse voltage.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in those scenarios.

Minimum DS Breakdown Voltage: 200 V

Can handle higher voltages, making it suitable for applications requiring high voltage tolerance.

Maximum Drain Current (ID): 0.25 A

Capable of handling relatively high current levels, suitable for demanding applications.

Maximum Power Dissipation (Abs): 1 W

Can dissipate heat effectively, allowing for continuous operation without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers good performance and efficiency, making the transistor a reliable choice.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for various environments.

Technical Specifications

Small Signal Field Effect Transistors (FET) BS107 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

.13 A

Maximum Drain Current (ID):

.25 A

Maximum Drain-Source On Resistance:

14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-226AA

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BS107 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

8010-00-851-4258, 8010008514258

NIIN

008514258

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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