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2SB1203S-H

Onsemi

2SB1203S-H by Onsemi

The Onsemi 2SB1203S-H is a NPN BJT transistor with max VCEsat of 0.4V, IC of 5A, and hFE of 35. Ideal for switching applications due to its high transition frequency of 180MHz and low collector-emitter voltage of 50V. With a power dissipation of 20W, it's suitable for various power electronics designs.

Median Price

$0.600

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 482 parts In-Stock

1+ parts

$0.940

100+ parts

$0.602

1k+ parts

$0.415

10k+ parts

$0.372

482

$0.940

$0.602

$0.415

$0.372

Rochester

USA . 13,500 parts In-Stock

1+ parts

-

100+ parts

$0.481

1k+ parts

$0.400

10k+ parts

$0.356

13,500

-

$0.481

$0.400

$0.356

DigiKey

USA . 13,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.600

10k+ parts

-

13,500

-

-

$0.600

-

Distributors (In-Stock)

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Digiode

USA . 2,132 parts In-Stock

1+ parts

$0.370

100+ parts

-

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2,132

$0.370

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Chip Stock

USA . 41,000 parts In-Stock

1+ parts

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41,000

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Vyrian

USA . 4,648 parts In-Stock

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4,648

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Distributors (Availability)

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Ampacity Inc.

Singapore . 8,979 parts In-Stock

1+ parts

$0.332

100+ parts

-

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-

10k+ parts

-

8,979

$0.332

-

-

-

Corphita

USA . 2,471 parts In-Stock

1+ parts

$0.351

100+ parts

-

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2,471

$0.351

-

-

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Corohmni

South Africa . 432 parts In-Stock

1+ parts

$0.390

100+ parts

-

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-

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432

$0.390

-

-

-

Component Stockers USA

USA . 12,597 parts In-Stock

1+ parts

$0.400

100+ parts

$0.380

1k+ parts

$0.340

10k+ parts

$0.340

12,597

$0.400

$0.380

$0.340

$0.340

Native Components

USA . 37 parts In-Stock

1+ parts

$1.568

100+ parts

-

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37

$1.568

-

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Northwest PG Solutions

USA . 2,167 parts In-Stock

1+ parts

$1.725

100+ parts

-

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2,167

$1.725

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QUARKTWIN TECHNOLOGY LTD

USA . 18,290 parts In-Stock

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18,290

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Continental Prestige Electronics

USA . 13,500 parts In-Stock

1+ parts

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100+ parts

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$0.347

10k+ parts

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13,500

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-

$0.347

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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Metaverse IC Inc.

Canada . 8,000 parts In-Stock

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8,000

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Problanco Electronics

Mexico . 7,333 parts In-Stock

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7,333

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Kulean Microsystems

USA . 3,518 parts In-Stock

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3,518

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TANS Electronics

Latvia . 2,052 parts In-Stock

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2,052

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SupplyDigital Components

Austria . 1,473 parts In-Stock

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1,473

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UHIMA Technologies

Türkiye . 733 parts In-Stock

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733

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Overview

Looking for a reliable and high-quality power transistor for your switching applications? Look no further than the 2SB1203S-H by Onsemi. With a maximum VCEsat of 0.4V and a DC current gain of 35, this NPN transistor offers efficient performance and durability. Whether you're designing power supplies, inverters, or motor control systems, this transistor's 20W maximum power dissipation and 5A collector current make it a versatile choice. Trust in Onsemi's reputation for excellence and innovation, and experience the value and benefits that the 2SB1203S-H can bring to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, ensuring compatibility with many electronic designs.

Configuration: SINGLE

Simplified setup and circuit design with a single transistor configuration.

Transistor Application: SWITCHING

Designed specifically for switching applications, offering efficient performance in switching circuits.

Maximum VCEsat: 0.4 V

Low VCEsat ensures minimal voltage drop when the transistor is conducting, leading to higher efficiency in the circuit.

Package Shape: RECTANGULAR

Ease of mounting and space-saving design with a rectangular package shape.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong physical connections and easy soldering for secure mounting.

Maximum Power Dissipation (Abs): 20 W

High power dissipation capability allows for handling of high power loads without overheating or damage.

Package Style (Meter): IN-LINE

In-line package style facilitates easy integration into circuit boards for streamlined assembly.

Maximum Power Dissipation Ambient: 1 W

Efficient heat dissipation in ambient conditions to ensure reliable operation under varying temperature environments.

Minimum DC Current Gain (hFE): 35

Sufficient DC current gain for reliable amplification and signal processing in electronic circuits.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows for use in diverse environmental conditions.

Maximum Collector-Base Capacitance: 40 pF

Low collector-base capacitance helps in reducing the risk of parasitic oscillations and maintaining signal integrity.

Maximum Collector-Emitter Voltage: 50 V

High collector-emitter voltage rating provides protection against voltage spikes and overloads in the circuit.

Transistor Element Material: SILICON

Silicon material ensures reliable performance and stability of the transistor in various operating conditions.

Maximum Collector Current (IC): 5 A

High collector current rating allows for handling of high current loads without saturation or damage to the transistor.

Terminal Finish: TIN BISMUTH

Tin bismuth terminal finish offers excellent solderability and corrosion resistance for long-lasting connections.

Terminal Position: SINGLE

Single terminal position simplifies circuit board layout and ensures proper orientation during installation.

Case Connection: COLLECTOR

Collector case connection for efficient heat dissipation and easy thermal management in the circuit.

Nominal Transition Frequency (fT): 180 MHz

High transition frequency provides fast switching and amplification capabilities for demanding applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) 2SB1203S-H attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

5 A

Maximum Collector-Base Capacitance:

40 pF

Maximum Collector-Emitter Voltage:

50 V

Configuration:

Minimum DC Current Gain (hFE):

35

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e6

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

1 W

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

TIN BISMUTH

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

.4 V

Trade Compliance

2SB1203S-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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