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2N6338G

Onsemi

2N6338G by Onsemi

The Onsemi 2N6338G is a NPN BJT transistor with max. collector-emitter voltage of 100V, max. collector current of 25A, and max. power dissipation of 200W. Ideal for switching applications due to its single configuration and high transition frequency of 40MHz in a round package shape.

Median Price

$11.270

Lifecycle Status

EOL

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1 parts In-Stock

1+ parts

$6.362

100+ parts

-

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1

$6.362

-

-

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Rochester

USA . 1,294 parts In-Stock

1+ parts

$11.270

100+ parts

$11.040

1k+ parts

$10.820

10k+ parts

-

1,294

$11.270

$11.040

$10.820

-

DigiKey

USA . 96 parts In-Stock

1+ parts

$11.860

100+ parts

$9.206

1k+ parts

$8.189

10k+ parts

-

96

$11.860

$9.206

$8.189

-

Mouser Electronics

USA . 295 parts In-Stock

1+ parts

$17.050

100+ parts

$12.990

1k+ parts

$10.800

10k+ parts

$10.050

295

$17.050

$12.990

$10.800

$10.050

Flip Electronics (Authorized)

USA . 1,400 parts In-Stock

1+ parts

-

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1,400

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Arrow

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$6.362

1k+ parts

-

10k+ parts

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1

-

$6.362

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 415 parts In-Stock

1+ parts

$6.044

100+ parts

-

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415

$6.044

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-

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Vyrian

USA . 8,348 parts In-Stock

1+ parts

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8,348

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Flip Electronics

USA . 1,200 parts In-Stock

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1,200

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North Shore Components

USA . 83 parts In-Stock

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83

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 627 parts In-Stock

1+ parts

$0.454

100+ parts

-

1k+ parts

-

10k+ parts

$0.435

627

$0.454

-

-

$0.435

Northwest PG Solutions

USA . 2,293 parts In-Stock

1+ parts

$0.499

100+ parts

-

1k+ parts

-

10k+ parts

$0.440

2,293

$0.499

-

-

$0.440

Corphita

USA . 1,666 parts In-Stock

1+ parts

$5.726

100+ parts

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1,666

$5.726

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Corohmni

South Africa . 259 parts In-Stock

1+ parts

$5.990

100+ parts

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259

$5.990

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Component Stockers USA

USA . 1,915 parts In-Stock

1+ parts

$6.350

100+ parts

$8.410

1k+ parts

-

10k+ parts

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1,915

$6.350

$8.410

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Microchip USA

USA . 5,875 parts In-Stock

1+ parts

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5,875

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SupplyDigital Components

Austria . 4,249 parts In-Stock

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4,249

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Problanco Electronics

Mexico . 3,090 parts In-Stock

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3,090

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Glotronic Ltd.

UK . 2,780 parts In-Stock

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2,780

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TANS Electronics

Latvia . 2,508 parts In-Stock

1+ parts

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2,508

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Kulean Microsystems

USA . 2,225 parts In-Stock

1+ parts

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2,225

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UHIMA Technologies

Türkiye . 707 parts In-Stock

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707

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Continental Prestige Electronics

USA . 607 parts In-Stock

1+ parts

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100+ parts

$9.430

1k+ parts

-

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607

-

$9.430

-

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Overview

Power up your projects with the 2N6338G by Onsemi, a high-quality Power BJT transistor designed for switching applications. Manufactured by the trusted brand Onsemi, this NPN transistor offers reliable performance and durability. With a maximum power dissipation of 200W and a maximum collector current of 25A, this transistor provides exceptional value for a wide range of electronic projects. Whether you're designing power supplies, amplifiers, or motor control systems, the 2N6338G is the perfect choice for your next application. Trust Onsemi for superior quality and performance in every project.

Feature Benefit Bullets

Package Body Material: METAL

The metal package body provides better heat dissipation, enhancing the overall performance and reliability of the transistor.

Polarity or Channel Type: NPN

NPN transistors are commonly used in switching applications due to their high input impedance, making this transistor suitable for various switching tasks.

Configuration: SINGLE

The single configuration allows for easy integration into circuits, simplifying the design and assembly process.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and high efficiency, making it ideal for use in power electronic circuits.

Package Shape: ROUND

The round package shape provides mechanical robustness and allows for easy mounting in a variety of applications.

Terminal Form: PIN/PEG

The pin/peg terminal form ensures secure connections and reliable performance in different circuit configurations.

Maximum Power Dissipation (Abs): 200 W

With a high maximum power dissipation of 200 W, this transistor can handle high power levels, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers convenient mounting options and provides stability during operation.

Minimum DC Current Gain (hFE): 12

The minimum DC current gain of 12 ensures reliable amplification of signals, contributing to the overall performance of the transistor.

Maximum Operating Temperature: 200 °C

With a maximum operating temperature of 200°C, this transistor can withstand high temperature environments, increasing its versatility in various applications.

Maximum Collector-Emitter Voltage: 100 V

The high maximum collector-emitter voltage of 100 V allows for safe operation in applications where high voltage levels are present.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, ensuring long-term stability and consistent operation.

Maximum Collector Current (IC): 25 A

With a maximum collector current of 25 A, this transistor can handle high current levels, making it suitable for power applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and prevents oxidation, ensuring reliable connections and long-term performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies the soldering process and allows for easy integration into circuit boards.

Case Connection: COLLECTOR

The collector case connection allows for efficient heat dissipation, contributing to the overall thermal management of the transistor.

Nominal Transition Frequency (fT): 40 MHz

With a high nominal transition frequency of 40 MHz, this transistor offers fast switching speeds and high-frequency performance, making it suitable for RF applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) 2N6338G attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

100 V

Configuration:

Minimum DC Current Gain (hFE):

12

JEDEC-95 Code:

TO-204AA

JESD-30 Code:

O-MBFM-P2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

PIN/PEG

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

2N6338G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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