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2N6325

Texas Instruments

2N6325 by Texas Instruments

2N6325 by Texas Instruments is a NPN BJT with 300V VCE, 30A IC, and 200W Ptot. Ideal for power applications due to its high voltage and current ratings. Suitable for use in circuits requiring high power dissipation and collector-emitter voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,433 parts In-Stock

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Digiode

USA . 2,652 parts In-Stock

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2,652

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Mil-Aero Solutions, Inc.

USA . 5 parts In-Stock

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Parana Technologies

USA . 1,198 parts In-Stock

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$0.830

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-

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$1.795

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$0.830

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$1.795

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DigiPath Technology Company

USA . 2,282 parts In-Stock

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$0.914

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$0.841

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ChromeModa Solutions

Germany . 585 parts In-Stock

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$0.933

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$0.765

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$0.765

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IDEA Electronic Components Group

UK . 560 parts In-Stock

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$0.933

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$0.840

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560

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$0.840

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Native Components

USA . 68 parts In-Stock

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$10.360

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68

$10.360

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AZTECH Wire

Italy . 201 parts In-Stock

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$11.359

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Northwest PG Solutions

USA . 972 parts In-Stock

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$11.396

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$10.256

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One Stop Electronics

USA . 1,062 parts In-Stock

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$62.050

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QUARKTWIN TECHNOLOGY LTD

USA . 7,223 parts In-Stock

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Microchip USA

USA . 5,431 parts In-Stock

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Glotronic Ltd.

UK . 2,780 parts In-Stock

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Corphita

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Overview

Unleash the power of innovation with the Texas Instruments 2N6325 Power Bipolar Junction Transistor. Designed for high-performance applications, this NPN transistor offers unrivaled quality and reliability. Its single configuration and robust design make it ideal for a wide range of electronic projects. With a maximum power dissipation of 200W and a maximum collector current of 30A, this transistor delivers exceptional performance in demanding environments. Trust Texas Instruments to provide cutting-edge technology that exceeds your expectations. Elevate your designs with the 2N6325 and experience the difference today.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body provides excellent heat dissipation, allowing the transistor to operate at higher power levels without overheating.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplifier circuits due to their ability to amplify current and switch high currents.

Configuration: SINGLE

Single configuration simplifies circuit design and makes the transistor easy to integrate into electronic systems.

Package Shape: ROUND

Round package shape is compact and easy to mount, making it suitable for space-constrained applications.

Terminal Form: SOLDER LUG

Solder lug terminals provide secure and reliable connections, ensuring stable operation of the transistor in various environments.

Maximum Power Dissipation (Abs): 200 W

High power dissipation capability allows the transistor to handle large power levels without damage, making it suitable for high-power applications.

Package Style (Meter): POST/STUD MOUNT

Post/stud mount package style facilitates easy mounting and installation of the transistor in different devices and systems.

Minimum DC Current Gain (hFE): 6

Minimum DC current gain of 6 ensures stable and predictable amplification characteristics, making the transistor suitable for amplifier circuits.

Maximum Operating Temperature: 200 °C

High maximum operating temperature ensures reliable performance of the transistor in demanding thermal conditions.

Maximum Collector-Emitter Voltage: 300 V

High maximum collector-emitter voltage rating of 300 V allows the transistor to withstand high voltage conditions in the circuit.

Transistor Element Material: SILICON

Silicon transistor element material offers high reliability and efficiency in amplification and switching applications.

Maximum Collector Current (IC): 30 A

High maximum collector current rating of 30 A enables the transistor to handle large current flows, making it suitable for high-current applications.

Terminal Position: UPPER

Upper terminal position allows for convenient connection and integration of the transistor in circuit layouts.

Case Connection: COLLECTOR

Collector case connection simplifies circuit design and ensures efficient signal path for the transistor.

Nominal Transition Frequency (fT): 10 MHz

High nominal transition frequency of 10 MHz indicates fast switching speed, making the transistor suitable for high-frequency applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) 2N6325 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Texas Instruments

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

300 V

Configuration:

Minimum DC Current Gain (hFE):

6

JEDEC-95 Code:

TO-63

JESD-30 Code:

O-MUPM-D3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

POST/STUD MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Form:

SOLDER LUG

Terminal Position:

UPPER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

2N6325 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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