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BSH111BK

NXP Semiconductors

BSH111BK by NXP Semiconductors

The NXP Semiconductors BSH111BK is a small signal N-channel FET with 55V breakdown voltage and 0.21A drain current. Ideal for switching applications, it features a built-in diode, 4Ω on resistance, and operates in enhancement mode. The package is surface mountable with Gull Wing terminals and a rectangular shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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LWI Electronics Inc

India . 27,000 parts In-Stock

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VNN

France . 2,807 parts In-Stock

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Anansix

USA . 2,568 parts In-Stock

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Contempo Components LLC

USA . 1,000 parts In-Stock

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Digiode

USA . 912 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Vyrian

USA . 192 parts In-Stock

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192

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Aztec Data Supply Inc.

USA . 4,561 parts In-Stock

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$0.560

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Corohmni

South Africa . 821 parts In-Stock

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$1.674

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AZTECH Wire

Italy . 10,957 parts In-Stock

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$18.604

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One Stop Electronics

USA . 772 parts In-Stock

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$48.050

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772

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Ampacity Inc.

Singapore . 137 parts In-Stock

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$65.050

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Infinite Electronics LLP (Excess)

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 15,860 parts In-Stock

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Lixinc

USA . 14,962 parts In-Stock

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Continental Prestige Electronics

USA . 5,162 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,573 parts In-Stock

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Kepictronics

USA . 3,160 parts In-Stock

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Corphita

USA . 2,614 parts In-Stock

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Supply Digital

USA . 2,221 parts In-Stock

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Argo Parts USA

USA . 1,420 parts In-Stock

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UNI Independent Distributors

Spain . 1,170 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Upgrade your electronic devices with the BSH111BK by NXP Semiconductors, a top-quality Small Signal Field Effect Transistor that offers unparalleled performance and reliability. Manufactured by industry leader NXP Semiconductors, this N-channel transistor is ideal for switching applications, providing enhanced functionality and efficiency. With a minimum DS breakdown voltage of 55V and maximum drain current of 0.21A, this transistor delivers exceptional results every time. Trust NXP Semiconductors to bring cutting-edge technology to your projects and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good thermal characteristics and helps in dissipating heat efficiently, making this product reliable for continuous operation.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have lower ON-resistance and higher electron mobility, resulting in better performance and efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can handle rapid switching speeds with minimal loss, making it ideal for various electronic circuits.

Minimum DS Breakdown Voltage: 55 V

With a minimum breakdown voltage of 55V, this transistor can handle higher voltage levels without getting damaged, ensuring durability and reliability in different circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high input impedance and low output impedance, providing efficient signal amplification and low power consumption.

Maximum Drain Current (ID): 0.21 A

Capable of handling a maximum drain current of 0.21A, this transistor is suitable for circuits that require moderate current flow, ensuring stable performance under load.

Maximum Drain-Source On Resistance: 4 ohm

With a low drain-source on resistance of 4 ohms, this transistor minimizes power losses and heat dissipation, enhancing overall efficiency in electronic circuits.

Surface Mount: YES

Being surface mountable, this transistor can be easily integrated onto PCBs, saving space and facilitating automated assembly processes for mass production.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSH111BK attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (ID):

.21 A

Maximum Drain-Source On Resistance:

4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

7 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Reference Standard:

IEC-60134

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSH111BK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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