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BSH105,215

NXP Semiconductors

BSH105,215 by NXP Semiconductors

BSH105,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 20V. It is used for switching applications and has a max drain current of 1.05A and max power dissipation of 0.417W.

Median Price

$0.108

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

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Newark

USA . 1 parts In-Stock

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RS (Exports)

UK . 75,000 parts In-Stock

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Farnell

UK . 32,604 parts In-Stock

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EBV Elektronik

Germany . 12,000 parts In-Stock

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Arrow

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Verical

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Rochester

USA . 590 parts In-Stock

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$0.076

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Element14

Singapore . 1 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 866 parts In-Stock

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Nova Conductors

Japan . 53 parts In-Stock

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Chip Stock

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NAC Semi

USA . 30,000 parts In-Stock

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IBS Electronics

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VNN

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Vyrian

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Bristol Electronics

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Atlantic Semiconductor

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Semtec, LLC

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Micros

Poland . 4,254 parts In-Stock

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Partservice

France . 4,144 parts In-Stock

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Micros sp.j. W. Kędra i J. Lic

Poland . 4,144 parts In-Stock

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South Electronics

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Greenchips

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Speed Components Ltd

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LIBRA Elektronik GmbH

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Anansix

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Prism Electronics

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Semi Source

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ComSIT Distribution GmbH

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Semicontronic

India . 631,736 parts In-Stock

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Corphita

USA . 503 parts In-Stock

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Argo Parts USA

USA . 1,833 parts In-Stock

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AZTECH Wire

Italy . 5,715 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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$0.482

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$0.435

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Aztec Data Supply Inc.

USA . 2,296 parts In-Stock

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$0.577

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Modulus Dynamics

Lithuania . 2,394 parts In-Stock

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$1.034

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Eastek

USA . 786,000 parts In-Stock

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GreenTree Electronics

Israel . 729,000 parts In-Stock

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Perfect Parts

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Continental Prestige Electronics

USA . 74,863 parts In-Stock

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$0.074

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Lucentia Tech

USA . 44,448 parts In-Stock

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$0.416

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$0.408

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$0.408

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Robosynatics

Brazil . 22,224 parts In-Stock

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$0.417

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Kepictronics

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UNI Independent Distributors

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Supply Digital

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Component Connect

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 1,769 parts In-Stock

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Corohmni

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Lixinc

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Netroflash

USA . 50 parts In-Stock

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Overview

Discover the power of the BSH105,215 by NXP Semiconductors, a small signal field effect transistor designed to elevate your electronic projects. Manufactured with precision and expertise by NXP Semiconductors, this transistor guarantees unmatched quality and reliability. With its N-channel polarity and single configuration boasting a built-in diode, this transistor is perfect for switching applications. Its compact rectangular shape and surface mount capability make it incredibly versatile. Experience enhanced performance and efficiency with a maximum drain current of 1.05 A and minimal power dissipation. Let the BSH105,215 revolutionize your projects and unleash your creativity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's use of plastic/epoxy material for the package body makes it durable and resistant to environmental factors, ensuring reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

The N-channel design of this product allows for better conductivity and performance, making it suitable for a wide range of switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The inclusion of a built-in diode in this single configuration enhances its functionality, allowing for efficient control and protection against reverse currents.

Transistor Application: SWITCHING

Designed specifically for switching applications, this product demonstrates high-speed performance and low power consumption, making it an ideal choice for efficient circuit operation.

Surface Mount: YES

With its surface mount capability, this product offers ease of installation and saves valuable space on the circuit board, making it convenient for compact designs.

Minimum DS Breakdown Voltage: 20 V

The 20V minimum DS breakdown voltage ensures this transistor can handle high voltages, providing reliable and stable operation in demanding electronic circuits.

Package Shape: RECTANGULAR

Featuring a rectangular package shape, this product offers efficient space utilization and facilitates easy integration into various circuit layouts.

Terminal Form: GULL WING

Equipped with gull wing terminal form, this transistor enables secure and reliable soldering connections, ensuring excellent electrical contact in the circuit.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operating mode of this transistor allows for improved control, resulting in enhanced performance and operational efficiency.

Maximum Drain Current (Abs) (ID): 1.05 A

With a maximum drain current of 1.05 A, this transistor can effectively handle high current loads, meeting the requirements of power-intensive applications.

No. of Terminals: 3

Featuring three terminals, this transistor offers versatile connectivity options, allowing for easy integration into complex circuit configurations.

Maximum Power Dissipation (Abs): 0.417 W

With a maximum power dissipation of 0.417 W, this transistor can effectively handle high power loads, ensuring stable and efficient circuit operation.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this transistor saves space on the circuit board, making it particularly suitable for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology, this transistor offers excellent electrical performance with low power consumption, ensuring efficient operation in a variety of applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high-temperature environments, ensuring reliable operation even under demanding conditions.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures excellent electrical properties, making this transistor highly reliable and capable of delivering superior performance in various applications.

Terminal Finish: TIN

With a terminal finish of tin, this transistor provides excellent solderability and corrosion resistance, ensuring long-term reliability in diverse operating environments.

Maximum Drain-Source On Resistance: 0.25 ohm

The maximum drain-source on resistance of 0.25 ohm ensures this transistor offers low power dissipation and high efficiency, making it an excellent choice for power-sensitive applications.

Terminal Position: DUAL

Featuring dual terminal positions, this transistor offers versatile installation options, allowing for easy integration into a wide range of circuit layouts.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this transistor ensures reliable solder joint integrity during the manufacturing process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C provides assurance for proper soldering during the manufacturing process and ensures the product's reliability.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSH105,215 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

1.05 A

Maximum Drain Current (ID):

1.05 A

Maximum Drain-Source On Resistance:

.25 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSH105,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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