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BSH103,235

NXP Semiconductors

BSH103,235 by NXP Semiconductors

The NXP Semiconductors BSH103,235 is a small signal N-CHANNEL FET with built-in diode for switching applications. It features a min DS breakdown voltage of 30V and max drain current of 0.9A. This enhancement mode transistor operates at a max temperature of 150°C, making it suitable for various electronic devices.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Arrow

USA . 80,000 parts In-Stock

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Verical

USA . 80,000 parts In-Stock

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Future Electronics

Canada . 60,000 parts In-Stock

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$0.300

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Distributors (In-Stock)

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Nova Conductors

Japan . 54 parts In-Stock

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$0.144

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Digiode

USA . 2,514 parts In-Stock

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$0.475

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$0.475

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Bristol Electronics

USA . 610 parts In-Stock

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$0.675

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$0.250

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$0.189

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610

$0.675

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$0.189

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IBS Electronics

USA . 70,000 parts In-Stock

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$0.491

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$0.491

Chip Stock

USA . 59,000 parts In-Stock

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NAC Semi

USA . 50,000 parts In-Stock

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$0.600

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Speed Components Ltd

Israel . 7,182 parts In-Stock

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Vyrian

USA . 4,188 parts In-Stock

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VNN

France . 1,097 parts In-Stock

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Anansix

USA . 672 parts In-Stock

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Prism Electronics

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Continental Prestige Electronics

USA . 3,795 parts In-Stock

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$0.138

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$0.135

3,795

$0.138

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$0.135

Argo Parts USA

USA . 413 parts In-Stock

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$0.138

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$0.134

413

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Netroflash

USA . 2,000 parts In-Stock

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$0.144

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$0.144

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Component Stockers USA

USA . 141,145 parts In-Stock

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$0.350

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$0.180

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$0.110

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$0.060

141,145

$0.350

$0.180

$0.110

$0.060

Aztec Data Supply Inc.

USA . 407 parts In-Stock

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$0.400

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407

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Semicontronic

India . 57,131 parts In-Stock

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$0.433

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$0.422

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$0.420

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AZTECH Wire

Italy . 10,491 parts In-Stock

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$0.440

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$0.440

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Corphita

USA . 2,764 parts In-Stock

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$0.450

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Ampacity Inc.

Singapore . 54,938 parts In-Stock

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$0.940

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Corohmni

South Africa . 431 parts In-Stock

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$1.800

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431

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$1.821

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$1.730

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Eastek

USA . 40,000 parts In-Stock

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GreenTree Electronics

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iodParts Technologies Inc.

India . 16,845 parts In-Stock

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Glotronic Ltd.

UK . 16,000 parts In-Stock

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UNI Independent Distributors

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S.R.D Solutions

India . 3,000 parts In-Stock

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Supply Digital

USA . 1,049 parts In-Stock

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Microchip USA

USA . 268 parts In-Stock

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Overview

Discover the BSH103,235 by NXP Semiconductors, a cutting-edge Small Signal Field Effect Transistor that offers unparalleled performance and reliability. With a single configuration featuring a built-in diode, this transistor is ideal for switching applications. Its N-Channel design ensures efficient operation, while its high-quality construction guarantees long-lasting durability. Whether you're looking to enhance your electronic projects or streamline your manufacturing process, the BSH103,235 delivers unmatched value and performance. Experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY as package body material ensures durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors are commonly used in switching applications, making this transistor suitable for a wide range of electronic devices.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the functionality of the transistor, offering added convenience for circuit design and implementation.

Transistor Application: SWITCHING

Designed for switching applications, this transistor is suitable for controlling the flow of current in electronic circuits with efficiency and reliability.

Surface Mount: YES

Being surface mountable, this transistor is easy to integrate onto PCBs, saving space and simplifying assembly processes.

Maximum Drain Current (Abs): 0.9 A

With a high maximum drain current capacity of 0.9 A, this transistor can handle significant loads in various applications.

Maximum Operating Temperature: 150 °C

Operating efficiently at a maximum temperature of 150°C, this transistor is suitable for use in demanding environments without overheating.

Maximum Drain-Source On Resistance: 0.5 ohm

The low drain-source on resistance of 0.5 ohm ensures minimal power loss and efficient performance of the transistor in circuit applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSH103,235 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

.9 A

Maximum Drain Current (ID):

.85 A

Maximum Drain-Source On Resistance:

.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSH103,235 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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