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BSH103

NXP Semiconductors

BSH103 by NXP Semiconductors

BSH103 by NXP Semiconductors is a small signal FET with N-channel configuration and built-in diode, ideal for switching applications. It features a min DS breakdown voltage of 30V, max drain current of 0.85A, and operating temperature up to 150°C. The transistor's package is surface mountable with Gull Wing terminals in a rectangular shape.

Median Price

$0.113

Lifecycle Status

Suppliers In-Stock

38

In-Stock Inventory

1k+

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DF Sales Co.

USA . 1,990 parts In-Stock

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DF Sales Co.

USA . 1,990 parts In-Stock

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Maritex

Poland . 1,534 parts In-Stock

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USA . 3,615,000 parts In-Stock

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Dan-Mar Components

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LIBRA Elektronik GmbH

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PC Components Company LLC

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Bristol Electronics

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Micros

Poland . 3,890 parts In-Stock

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Partservice

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Micros sp.j. W. Kędra i J. Lic

Poland . 3,890 parts In-Stock

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Lantek

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Right Parts Inc.

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Cogito LLC

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Speed Components Ltd

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$0.879

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Aztec Data Supply Inc.

USA . 3,727 parts In-Stock

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Corohmni

South Africa . 625 parts In-Stock

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Ampacity Inc.

Singapore . 374 parts In-Stock

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AZTECH Wire

Italy . 5,864 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 1,495 parts In-Stock

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Perfect Parts

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Continental Prestige Electronics

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Glotronic Ltd.

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Corphita

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GreenTree Electronics

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Argo Parts USA

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Computer Components Inc. - USA

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Supply Digital

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Authorized Procurement Solutions

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Bastille Electronics

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Assy Fe

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Overview

Unleash the power of innovation with the NXP Semiconductors BSH103 Small Signal Field Effect Transistor. Designed for switching applications, this N-Channel transistor offers reliability and efficiency like no other. With a maximum drain current of 0.85 A and a minimum DS breakdown voltage of 30 V, this transistor is a game-changer in the world of electronics. Whether you're a hobbyist or a professional, the BSH103 is here to elevate your projects to new heights. Trust NXP Semiconductors for quality you can count on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors generally have higher mobility and conductivity, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection within the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Surface Mount: YES

Surface mount capability makes installation and PCB assembly easier, saving time and labor costs.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltages, providing a safety margin in the circuit.

Maximum Drain Current (Abs) (ID): 0.9 A

High maximum drain current allows for handling of larger loads, increasing the versatility of the transistor.

Maximum Power Dissipation (Abs): 0.75 W

Efficient power dissipation ensures the transistor can handle high-power applications without overheating.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand higher temperatures, suitable for various industrial environments.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSH103 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

.9 A

Maximum Drain Current (ID):

.85 A

Maximum Drain-Source On Resistance:

.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSH103 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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