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BSH111

NXP Semiconductors

BSH111 by NXP Semiconductors

The NXP Semiconductors BSH111 is a small signal N-CHANNEL FET with a built-in diode, ideal for SWITCHING applications. It features a 55V DS Breakdown Voltage, 0.335A Drain Current, and 4 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it offers reliable performance in various electronic circuits.

Median Price

$0.225

Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

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Bristol Electronics

USA . 2,660 parts In-Stock

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$0.225

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$0.045

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Cyclops Electronics Ltd

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LWI Electronics Inc

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LIBRA Elektronik GmbH

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Semtec, LLC

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J2 Sourcing AB

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PC Components Company LLC

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Pegasus Components GmbH

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Mil-Aero Solutions, Inc.

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Digiode

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Prism Electronics

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Vyrian

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VNN

France . 371 parts In-Stock

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Anansix

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Semicontronic

India . 1,065 parts In-Stock

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$0.049

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Corohmni

South Africa . 849 parts In-Stock

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$0.393

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One Stop Electronics

USA . 1,605 parts In-Stock

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Aztec Data Supply Inc.

USA . 8,371 parts In-Stock

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AZTECH Wire

Italy . 12,924 parts In-Stock

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Ampacity Inc.

Singapore . 470 parts In-Stock

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Infinite Electronics LLP (Excess)

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Perfect Parts

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Glotronic Ltd.

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Argo Parts USA

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Computer Components Inc. - USA

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Continental Prestige Electronics

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Supply Digital

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Bastille Electronics

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Corphita

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Overview

Discover the BSH111 by NXP Semiconductors, a top-quality Small Signal Field Effect Transistor that offers unparalleled performance in switching applications. With its N-CHANNEL configuration and built-in diode, this transistor is perfect for a wide range of electronic projects. The BSH111's compact design and high power dissipation make it a valuable asset for any tech enthusiast or professional looking to elevate their creations. Trust in NXP Semiconductors' expertise and innovation to bring you the best in semiconductor technology with the BSH111.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have faster switching speeds and lower ON-resistance compared to P-channel transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, making it ideal for control circuits and digital electronics.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB assembly, saving space and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 55 V

With a high breakdown voltage, this transistor can handle higher voltages without failure.

Maximum Drain Current (Abs) (ID): 0.335 A

Capable of handling a maximum current of 0.335 A, making it suitable for low to medium power applications.

Maximum Power Dissipation (Abs): 0.83 W

With a maximum power dissipation of 0.83 W, this transistor can operate reliably without overheating.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures of up to 150°C, suitable for a wide range of environments.

Maximum Drain-Source On Resistance: 4 ohm

Low ON-resistance allows for efficient power transfer and minimal heat generation during operation.

Maximum Feedback Capacitance (Crss): 10 pF

Low feedback capacitance ensures minimal signal loss and distortion, making it ideal for high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSH111 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

FAST SWITCHING

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

.335 A

Maximum Drain Current (ID):

.335 A

Maximum Drain-Source On Resistance:

4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSH111 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5306-14-492-8398, 5306144928398

NIIN

144928398

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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