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BLV99

NXP Semiconductors

BLV99 by NXP Semiconductors

NPN; Configuration: SINGLE; Surface Mount: NO; Highest Frequency Band: ULTRA HIGH FREQUENCY BAND; No. of Elements: 1; Package Body Material: CERAMIC, METAL-SEALED COFIRED;

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 1,974 parts In-Stock

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Digiode

USA . 1,935 parts In-Stock

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Vyrian

USA . 1,750 parts In-Stock

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1,750

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Bristol Electronics

USA . 431 parts In-Stock

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431

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Inventory MP

USA . 290 parts In-Stock

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290

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ComSIT Distribution GmbH

Germany . 160 parts In-Stock

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160

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ECAB

Sweden . 5 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 504 parts In-Stock

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$29.050

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504

$29.050

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UNI Independent Distributors

Spain . 8,067 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,116 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,744 parts In-Stock

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Northwest PG Solutions

USA . 2,353 parts In-Stock

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Kepictronics

USA . 980 parts In-Stock

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980

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Native Components

USA . 878 parts In-Stock

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Corphita

USA . 329 parts In-Stock

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Technical Specifications

RF Power Bipolar Junction Transistors (BJT) BLV99 attributes and parameters. Explore more RF Power Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Configuration:

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

O-CRPM-F4

No. of Elements:

1

No. of Terminals:

4

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

ROUND

Package Style (Meter):

POST/STUD MOUNT

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

FLAT

Terminal Position:

RADIAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLV99 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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