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BLV945A

NXP Semiconductors

BLV945A by NXP Semiconductors

BLV945A by NXP Semiconductors is an NPN RF power BJT designed for amplifier applications, featuring a max power dissipation of 60W and a min power gain of 9 dB. It operates in the ultra-high frequency band with a max collector current of 2A. Its ceramic, metal-sealed package ensures durability in demanding environments.

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3

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1k+

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Vyrian

USA . 4,543 parts In-Stock

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Digiode

USA . 1,807 parts In-Stock

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Anansix

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Native Components

USA . 895 parts In-Stock

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$8.458

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Northwest PG Solutions

USA . 224 parts In-Stock

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$9.304

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$8.373

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One Stop Electronics

USA . 748 parts In-Stock

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$25.050

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UNI Independent Distributors

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Corphita

USA . 3,983 parts In-Stock

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Overview

Unlock the power of innovation with the BLV945A from NXP Semiconductors! This premium RF Power Bipolar Junction Transistor is designed to deliver exceptional performance in ultra-high frequency applications. With its robust ceramic package and superior amplification capabilities, it ensures reliability and efficiency in every project. Elevate your designs and experience unmatched quality, backed by NXP's industry-leading expertise, making the BLV945A the ideal choice for engineers seeking excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable packaging material enhances thermal stability and reliability, ensuring long-lasting performance in demanding environments.

Polarity or Channel Type: NPN

The NPN configuration enables effective electrical conduction and is well-suited for high-speed applications, making it a versatile choice for amplifiers.

Configuration: COMMON EMITTER, 2 ELEMENTS

The common emitter configuration provides high voltage gain and flexibility, ideal for amplifying weak signals in various electronic circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this transistor excels in boosting signal strength, making it highly effective in audio and RF applications.

Surface Mount: YES

Surface mount capability allows for compact circuit designs, facilitating easier integration into modern electronic assemblies.

Minimum Power Gain (Gp): 9 dB

With a minimum power gain of 9 dB, this transistor effectively amplifies signals, optimizing performance in various applications.

Package Shape: RECTANGULAR

The rectangular shape is conducive for efficient space management within circuits, aiding in organized layout designs.

Terminal Form: FLAT

Flat terminals enhance soldering ease, ensuring secure connections and reliable performance in circuit assemblies.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra high frequency band ensures effective signal transmission and reception, ideal for communication applications.

No. of Elements: 2

Having two elements provides added functionality, enhancing the transistor's performance in complex circuit designs.

No. of Terminals: 4

Four terminals allow for versatile circuit configurations, enabling more complex designs and improved performance.

Package Style (Meter): FLANGE MOUNT

The flange mount style aids in stable mounting, which is crucial for maintaining performance under varying operational conditions.

Maximum Power Dissipation Ambient: 60 W

With a power dissipation rating of 60 W, this transistor can handle significant loads, ensuring operational stability even under heavy use.

Minimum DC Current Gain (hFE): 30

A minimum current gain of 30 facilitates efficient signal amplification, making it suitable for low-power applications.

Maximum Operating Temperature: 200 °C

A high maximum operating temperature of 200 °C ensures reliability in extreme environments, making it suitable for challenging applications.

Maximum Collector-Base Capacitance: 30 pF

Low collector-base capacitance minimizes unwanted oscillations, enabling clearer signal amplification.

Maximum Collector-Emitter Voltage: 27 V

This voltage capability allows for safe operation in various circuits, enhancing design flexibility.

Transistor Element Material: SILICON

Silicon as the element material provides excellent thermal conductivity and electronic properties, ensuring high performance.

Maximum Collector Current (IC): 2 A

With a maximum collector current rating of 2 A, this transistor effectively handles high-power applications.

Terminal Position: DUAL

Dual terminal position allows for easy integration into various circuit designs, providing flexibility in layout.

Case Connection: EMITTER

Emitter case connection simplifies circuit designs, enhancing user-friendliness and ease of application.

Technical Specifications

RF Power Bipolar Junction Transistors (BJT) BLV945A attributes and parameters. Explore more RF Power Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Additional Features:

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS

Case Connection:

EMITTER

Maximum Collector Current (IC):

2 A

Maximum Collector-Base Capacitance:

30 pF

Maximum Collector-Emitter Voltage:

27 V

Minimum DC Current Gain (hFE):

30

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F4

No. of Elements:

2

No. of Terminals:

4

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

60 W

Minimum Power Gain (Gp):

9 dB

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLV945A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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