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BLV947

NXP Semiconductors

BLV947 by NXP Semiconductors

BLV947 by NXP Semiconductors is an NPN RF power BJT designed for amplifier applications. It features a max power dissipation of 200W, operates at ultra-high frequencies, and supports surface mount with a rectangular ceramic package. Ideal for high-performance RF circuits.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 4,851 parts In-Stock

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Vyrian

USA . 577 parts In-Stock

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Anansix

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536

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One Stop Electronics

USA . 242 parts In-Stock

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$47.050

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UNI Independent Distributors

Spain . 5,745 parts In-Stock

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Corphita

USA . 4,526 parts In-Stock

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Native Components

USA . 892 parts In-Stock

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Northwest PG Solutions

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Overview

Experience unparalleled performance with the BLV947 from NXP Semiconductors, a leader in innovation. This high-quality RF Power BJT ensures optimal signal amplification in various applications, making it ideal for cutting-edge communication systems. With its robust ceramic and metal-sealed construction, the BLV947 is built to withstand demanding environments while delivering superior efficiency and reliability, empowering your designs to excel. Discover the advantage of quality engineering that elevates your projects!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This robust material choice enhances durability and reliability, making the transistor suitable for high-performance applications.

Polarity or Channel Type: NPN

The NPN configuration allows for efficient current flow control, making this transistor ideal for a wide range of amplification applications.

Configuration: COMMON EMITTER, 2 ELEMENTS

The common emitter configuration provides higher gain and better performance for amplification tasks, ensuring effective signal management.

Transistor Application: AMPLIFIER

Designed specifically as an amplifier, this transistor is tailored to enhance signal strength, ideal for various RF applications.

Surface Mount: YES

Surface mount capabilities facilitate compact designs and improve manufacturing efficiency, making it suitable for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape is optimal for efficient space usage on PCBs, allowing for better integration in complex circuit designs.

Terminal Form: FLAT

Flat terminals provide ease of soldering and better thermal dissipation, enhancing reliability and performance in real-world applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Its capability to operate in the UHF band ensures effective performance in high-frequency applications like communications and broadcasting.

No. of Elements: 2

Two elements in a single package minimize space and complexity while allowing for multi-functional applications, improving circuit efficiency.

No. of Terminals: 4

Four terminals facilitate better connection options and enhance circuit designs, allowing flexibility in electrical configurations.

Package Style (Meter): FLANGE MOUNT

The flange mount style provides secure attachment and improved heat dissipation, ensuring stable operation under high-load conditions.

Maximum Power Dissipation Ambient: 200 W

With a high power dissipation capability, this transistor can handle significant loads without overheating, making it suitable for demanding applications.

Minimum DC Current Gain (hFE): 30

A minimum gain of 30 allows for effective amplification of weak signals, ensuring better performance in audio and RF applications.

Maximum Operating Temperature: 200 °C

Operating effectively at high temperatures ensures reliability in extreme environments, maintaining performance integrity in challenging conditions.

Maximum Collector-Emitter Voltage: 28 V

A maximum voltage rating of 28V makes this transistor suitable for various power applications without the risk of breakdown.

Transistor Element Material: SILICON

Silicon as a semiconductor material provides good thermal stability and high performance, making this transistor a reliable choice for engineers.

Maximum Collector Current (IC): 1.65 A

This high collector current rating allows for considerable load handling, making it ideal for high-power amplifiers and RF applications.

Terminal Position: DUAL

Dual terminal positions enhance versatility in circuit design, allowing for more flexible layouts and simplified PCB manufacturing.

Case Connection: EMITTER

Emitter case connection simplifies circuit integration and improves thermal management, essential for high-efficiency operations.

Technical Specifications

RF Power Bipolar Junction Transistors (BJT) BLV947 attributes and parameters. Explore more RF Power Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Case Connection:

EMITTER

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

28 V

Minimum DC Current Gain (hFE):

30

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F4

No. of Elements:

2

No. of Terminals:

4

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

200 W

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLV947 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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