Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BAP65-02,135 by NXP Semiconductors is a surface mount PIN diode with a max operating temp of 150 °C and a reverse test voltage of 0V. It features low forward resistance (0.95Ω) and nominal capacitance (0.65pF). Ideal for RF applications, it ensures efficient signal processing.
Median Price
$0.430
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$0.408
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UNI Independent Distributors
A-Z Elektronik GmbH
The surface mount design allows for compact assembly and efficient use of board space, making it ideal for modern electronic designs.
Having a reverse test voltage of 0 V indicates a low leakage characteristic, which contributes to the reliability and performance of the diode.
With a maximum operating temperature of 150 °C, this diode can withstand high thermal environments, enhancing its applicability in demanding applications.
The tin terminal finish provides good solderability and corrosion resistance, ensuring stable performance over time.
A low forward resistance of 0.95 ohms minimizes power loss when current flows through the diode, contributing to energy efficiency in circuit designs.
With a very low nominal diode capacitance of 0.65 pF, this product minimizes signal distortion, making it suitable for high-frequency applications.
A nominal minority carrier lifetime of 0.17 microseconds indicates quick response to changing signals, allowing for effective operation in RF applications.
The minimum breakdown voltage of 30 V provides a robust safety margin, ensuring the diode is reliable under varied voltage conditions.
A maximum time of 30 seconds at peak reflow temperature indicates the diode's ability to withstand soldering processes without compromising integrity.
The ability to tolerate a peak reflow temperature of 260 °C makes this product compatible with lead-free soldering processes, supporting modern manufacturing practices.
Rated for a resistive test frequency of 100 MHz, this diode is suitable for high-speed applications, ensuring effective operation in communications systems.
Operating at a resistive test current of 5 mA allows for accurate performance assessment under low power conditions, demonstrating its versatility.
As a PIN diode, it combines the benefits of both p-n junctions and intrinsic layers, making it ideal for RF switching and attenuation applications.
PIN Diodes BAP65-02,135 attributes and parameters. Explore more PIN Diodes devices from NXP Semiconductors
Minimum Breakdown Voltage:
Nominal Diode Capacitance:
Maximum Diode Forward Resistance:
Diode Resistive Test Current:
Diode Resistive Test Frequency:
Diode Type:
JESD-609 Code:
Nominal Minority Carrier Lifetime:
Moisture Sensitivity Level (MSL):
Maximum Operating Temperature:
Peak Reflow Temperature (C):
Reverse Test Voltage:
Sub-Category:
Surface Mount:
Terminal Finish:
Maximum Time At Peak Reflow Temperature (s):
BAP65-02,135 Diodes trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8541.10.00
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
1N4148
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Unitrode
SS14
Jinan Jingheng Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
BAV99
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Forward Voltage (VF): .5 V;
STMicroelectronics
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
SMMBT2222ALT1G
SMMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, 0.6A IC, and 40V VCE. It has a hFE of 75, fT of 300MHz, and operates up to 150°C. Ideal for small signal applications in automotive electronics due to AEC-Q101 compliance.
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
Changzhou Galaxy Century Microelectronics
2N2222A
Texas Instruments
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
Pulse Electronics
LM358AN
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
APD0520-219
Isolink
PIN DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
BAR50-03W
Infineon Technologies
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BXY43P-FPP
PIN DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 4; Surface Mount: YES; Package Shape: SQUARE;
1SV121RY
Renesas Electronics
PIN DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FMMP3112
Diodes Incorporated
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BAR6402ELE6327XTMA1
PIN DIODE; Surface Mount: YES; Diode Element Material: SILICON; Diode Resistive Test Frequency: 100 MHz; Moisture Sensitivity Level (MSL): 1; Minimum Breakdown Voltage: 150 V;
SMP1304-004LF
Skyworks Solutions
SMP1304-004LF by Skyworks Solutions is a PIN diode with common cathode, 2 elements. It operates in high frequency to L band range, with 0.3 pF diode capacitance. Ideal for attenuator applications due to its low forward resistance of 2 ohm and max power dissipation of 0.25 W.
BAR8902LRHE6327XTSA1
Infineon's BAR8902LRHE6327XTSA1 is a single PIN diode for L Band applications. With a max diode capacitance of 0.35 pF, it offers low forward resistance of 1.5 ohm and can handle up to 0.25 W power dissipation efficiently at temperatures up to 150°C. Ideal for switching applications due to its positive-intrinsic-negative technology and silicon element material in a chip carrier package style.
1SV172(TE85L,F)
Toshiba
PIN DIODE; Surface Mount: YES; Reverse Test Voltage: 50 V; Maximum Operating Temperature: 125 Cel; Minimum Breakdown Voltage: 50 V; Nominal Diode Capacitance: .25 pF;
BAR64-04W-E6327
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 125 Cel; Minimum Breakdown Voltage: 150 V; Peak Reflow Temperature (C): 260; Diode Resistive Test Current: 1 mA;
1SV128TE85L2
MA4P7446F-1091T
TE Connectivity
TE Connectivity's MA4P7446F-1091T is a PIN diode with 100V reverse test voltage, 0.5 ohm max forward resistance, and 2.2 pF capacitance. Ideal for RF switches in applications requiring high breakdown voltage, low forward resistance, and fast switching capabilities at up to 125°C operating temperature.
934056634315
NXP Semiconductors
PIN DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1SV157
PIN DIODE;
BAP64-02,115
NXP Semiconductors' BAP64-02,115 is a PIN diode with 0V reverse test voltage and 0.35 pF max capacitance. It operates in S band frequency for applications like attenuators and switches. With a small outline package style, it can handle temperatures from -65 to 150°C.
BAQ806,115
PIN DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
934061238315
MA4P4301F-1091T
M/a-com Technology Solutions
PIN DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAP63LX,315
PIN DIODE; Terminal Position: BOTTOM; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMP1302-079LF
SMP1302-079LF by Skyworks Solutions is a PIN diode with 0.3 pF capacitance, 1.5 ohm forward resistance, and 0.25 W power dissipation. It is used in attenuators and switching applications for high frequency to L band operations. The diode has a breakdown voltage of 200 V, operates at up to 150°C, and features positive-intrinsic-negative technology.
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BAP64-06,215
BAP64-06,215 by NXP Semiconductors is a PIN diode with common anode configuration and 2 elements. It operates in the S band frequency range and has a max diode capacitance of 0.35 pF. This diode is commonly used as an attenuator or for switching applications.
BAP64-05,215
BAP65-03,115
BAP65-03,115 by NXP Semiconductors is a single PIN diode with a max diode capacitance of 0.9 pF. It is used in applications such as attenuators and switching, with a max operating temperature of 150°C and a min operating temperature of -65°C.
BAP64-04W,115
BAP65-02,115
BAP65-02,115 by NXP Semiconductors is a PIN diode with 0.9 pF capacitance and 0.9 ohm forward resistance. It is used in attenuators and switching applications, operating b/w -65 to 150 °C. This small outline diode has a breakdown voltage of 30 V and can handle up to 0.715 W power dissipation.
BAP64-03
BAP63-05W,115
BAP64-03/DG/B2/AX
BAP64-03T/R
BAP63-02
BAP63-03
BAP63LX
BAP64-02T/R
BAP63-05W
BAP64-03,115
BAP63-02T/R
BAP63-03,115
BAP63LXT/R
PIN DIODE; Surface Mount: YES; Reverse Test Voltage: 0 V; Diode Resistive Test Frequency: 100 MHz; Maximum Operating Temperature: 150 Cel; Nominal Minority Carrier Lifetime: .32 us;
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