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MT48LC16M16A2TG-75:DTR

Micron Technology

MT48LC16M16A2TG-75:DTR by Micron Technology

MT48LC16M16A2TG-75:DTR by Micron Technology is a 16MX16 DRAM with 16777216 words, 268435456 bit memory density, and operates at 3.3V. It is used in commercial applications for synchronous memory operations with a max access time of 5.4 ns.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 3,500 parts In-Stock

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3,500

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Vyrian

USA . 2,985 parts In-Stock

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2,985

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Digiode

USA . 1,201 parts In-Stock

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1,201

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Bristol Electronics

USA . 1,000 parts In-Stock

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1,000

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Connector Distribution Corp

USA . 100 parts In-Stock

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100

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Right Parts Inc.

USA . 100 parts In-Stock

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100

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Goldney Electronics S.L.

Spain . 52 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,581 parts In-Stock

1+ parts

$9.000

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$9.000

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AZTECH Wire

Italy . 891 parts In-Stock

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$16.860

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891

$16.860

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Component Stockers USA

USA . 553 parts In-Stock

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$99.990

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553

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 5,930 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 1,398 parts In-Stock

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1,398

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ChipTracer

USA . 1,000 parts In-Stock

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Microchip USA

USA . 127 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the MT48LC16M16A2TG-75:DTR by Micron Technology, a leading manufacturer known for its high-quality DRAM products. This versatile component, designed with advanced technology and a compact package, is perfect for a wide range of applications. Boost your device's speed and efficiency with this reliable memory solution that offers unmatched value, benefits, and advantages to customers looking for top-notch performance. Upgrade your electronics today with Micron Technology's innovative DRAM product!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DRAM, ensuring a longer lifespan.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for data transfers to be synchronized with the system clock, increasing overall efficiency.

Nominal Supply Voltage / Vsup (V): 3.3

This voltage level is commonly used in many electronic systems, ensuring compatibility and ease of integration.

Memory Density: 268435456 bit

High memory density allows for storing a large amount of data in a compact form, making it suitable for devices with limited space.

Maximum Access Time: 5.4 ns

Fast access time means quicker data retrieval, enhancing the performance of the overall system.

Technical Specifications

DRAM MT48LC16M16A2TG-75:DTR attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e0

Length:

22.22 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

MT48LC16M16A2TG-75:DTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.24

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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