Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MPF300TL-FCG784E by Microchip Technology is a 300000 logic cell FPGA with CMOS technology. It has 388 inputs and outputs, operates b/w 0-100°C, and uses a grid array package style. Ideal for applications requiring high-speed data processing in compact electronic devices.
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PLASTIC/EPOXY package body material is durable and provides good protection for the internal components of the FPGA, ensuring reliability and longevity.
Having a large number of logic cells allows for complex programmable logic designs to be implemented, making this FPGA suitable for a wide range of applications.
Surface mount capability makes installation and assembly of this FPGA easier, saving time and effort in production processes.
The maximum supply voltage of 1.03V ensures safe operation within specified limits, protecting the FPGA from potential damage due to overvoltage.
CMOS technology offers low power consumption and high noise immunity, making this FPGA energy-efficient and reliable in various operating conditions.
With a high number of inputs, this FPGA can accommodate a large number of external signals, enabling complex input-output configurations in programmable logic circuits.
The square package shape provides a compact and space-efficient design, making it suitable for applications where size constraints are a consideration.
The ball form of terminal adds mechanical strength and thermal conductivity to the package, ensuring reliable interconnection and heat dissipation for optimal performance.
Having a high number of terminals allows for versatile connectivity options and enables integration with various external components, enhancing the flexibility of the FPGA.
Being a field-programmable gate array, this IC type offers the flexibility to reconfigure the logic functions within the FPGA, allowing for rapid prototyping and customization.
The grid array package style offers a reliable and robust interconnection structure, ensuring secure mounting and efficient signal transmission for the FPGA.
The minimum supply voltage of 0.97V allows for low-power operation and helps in minimizing energy consumption, making this FPGA suitable for battery-powered applications.
With a maximum operating temperature of 100°C, this FPGA can withstand high temperature environments, ensuring reliable performance in demanding conditions.
The 1mm pitch of the terminal allows for fine-pitch mounting, enabling high-density integration and compact PCB layouts for efficient circuit designs.
The minimum operating temperature of 0°C ensures reliable operation even in cold environments, making this FPGA suitable for a wide range of temperature conditions.
Having the terminal positioned at the bottom facilitates easy mounting and rework processes, ensuring efficient assembly and maintenance of the FPGA.
The maximum seated height of 3.47mm allows for low-profile installation, making this FPGA suitable for space-constrained applications and compact electronic devices.
With a width of 29mm, this FPGA offers a compact form factor, making it suitable for applications where space-saving designs are essential.
Having a high number of outputs allows for versatile signal routing options and enables complex output configurations in programmable logic circuits, enhancing the functionality of the FPGA.
With a length of 29mm, this FPGA offers a balanced form factor, providing a versatile design that can be easily integrated into various electronic systems and applications.
Field Programmable Gate Arrays (FPGA) MPF300TL-FCG784E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology
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MPF300TL-FCG784E Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Revised timing data 26/Aug/2021 Datasheet Update 02/Jun/2022
PCN Assembly/Origin - Manufacturing Change 23/Feb/2021
PCN Other - Security change 29/May/2019
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
2N7002
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
SMBJ18CA
Multicomp Pro
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
BAV99
Toshiba
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
Texas Instruments
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
LM317TG
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Minimum Input-Output Voltage Differential: 3 V; Qualification Status: Not Qualified; No. of Functions: 1;
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
OPA2277UA/2K5
OPA2277UA/2K5 by Texas Instruments is a dual operational amplifier with low offset voltage of 100 uV and micropower consumption of 0.004 uA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1 MHz. With a compact rectangular package style, it is suitable for surface mount designs in various electronic systems.
LM358N
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM107H/883
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
NE555D
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
1N4148WS
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
Temic Semiconductors
XC7A200T-2FBG676C
Xilinx
Xilinx XC7A200T-2FBG676C FPGA features 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.
EP3C16Q240C8N
Intel
EP3C16Q240C8N by Intel is a CMOS FPGA with 15408 logic cells, 160 inputs/outputs, and a clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities, such as telecommunications equipment and industrial automation systems.
XC7A35T-1CSG324I
The Xilinx XC7A35T-1CSG324I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications requiring high-speed processing and low power consumption. With a package style of grid array and low profile, it offers versatile integration options for various electronic systems.
10M04SAU169C8G
Intel's 10M04SAU169C8G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a supply voltage range of 2.85V to 3.15V, it is ideal for applications requiring high-speed processing and programmable logic capabilities in various industries such as telecommunications and automotive electronics.
EP2C8F256C8N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
ICE40LP4K-CM121
Lattice Semiconductor
ICE40LP4K-CM121 by Lattice Semiconductor is a FPGA with 3520 logic cells, 440 CLBs, and max clock frequency of 133 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor.
10CL025YU256C8G
Intel's 10CL025YU256C8G FPGA features 1539 CLBs, operates at 1.2V, and has a max supply voltage of 1.25V. Ideal for applications requiring high-performance computing in a compact form factor with a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.
XC6SLX45-2CSG324C
The Xilinx XC6SLX45-2CSG324C is a FPGA with 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. Operating at up to 667 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a low profile grid array package style, it offers flexibility in design while maintaining reliability.
EP4CE40F23I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
EP3C25F324C8N
EP3C25F324C8N by Intel is a CMOS FPGA with 24624 logic cells and CLBs. It operates at a max clock frequency of 472.5 MHz, making it suitable for high-speed applications in various industries such as telecommunications, automotive, and aerospace. With a package style of grid array and moisture sensitivity level of 3, this FPGA offers flexibility and reliability in design implementations.
XC7A100T-2FTG256C
Xilinx XC7A100T-2FTG256C is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1286 MHz. Ideal for high-speed applications requiring low profile grid array packages. Operating temp range: 0-85°C.
LCMXO2-640HC-4MG132I
LCMXO2-640HC-4MG132I by Lattice Semiconductor is a FPGA with 640 logic cells, 79 inputs/outputs, and operates at 2.5V nominal voltage. It is used in applications requiring high-performance computing and programmable IC solutions.
10M04DCU324I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
EP3C10F256C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: RECTANGULAR;
EP4CE6F17C8N
EP4CE6F17C8N by Intel is a FPGA with 6272 logic cells, 392 CLBs, and max clock freq of 472.5 MHz. Ideal for applications requiring high-speed processing like signal processing, image recognition, and data encryption due to its low profile grid array package style and versatile programmable IC type.
XCAU15P-L1UBVA368I
FIELD PROGRAMMABLE GATE ARRAY;
XQR5VFX130-1CN1752B
Xilinx XQR5VFX130-1CN1752B is a 131072 logic cell FPGA with 10240 CLBs, operating at -55 to 125 °C. It uses CMOS technology, has a max supply voltage of 1.05 V, and total dose of 1M Rad(Si). Ideal for military applications requiring high-performance computing in harsh environments.
EP3C16F256I7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: RECTANGULAR;
EP4CE40F23C8N
EP4CE40F23C8N by Intel is a FPGA with 39600 logic cells, 2475 CLBs, and max clock frequency of 472.5 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data processing units.
XC7S6-2CPGA196I
The Xilinx XC7S6-2CPGA196I FPGA features 6000 logic cells, 469 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with fine pitch terminals.
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MPF300T-1FCG784E
Microchip Technology
MPF300T-1FCG784E by Microchip Tech is a 300K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w 0-100°C, and uses plastic/epoxy package for surface mount applications.
MPF300TS-1FCG1152I
MPF300TS-1FCG1152I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 300,000 logic cells. It has a package body material of PLASTIC/EPOXY and features surface mount technology. This FPGA is suitable for applications requiring high-performance programmable ICs.
MPF300T-FCG484I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
MPF300T-FCG484I by Microchip Technology is a CMOS FPGA with 300,000 logic cells and 244 inputs/outputs. It operates b/w -40 to 100°C, has a package size of 23x23mm, and uses a grid array style. Ideal for industrial applications requiring high-density programmable logic in a compact form factor.
MPF300T-FCVG484I
MPF300T-FCVG484I by Microchip is a 300K logic cell FPGA with CMOS tech. It has 284 inputs/outputs, operates b/w -40 to 100°C, and uses 0.97-1.03 V supply voltage. Ideal for industrial applications requiring high-density programmable logic solutions in a compact grid array package.
MPF300T-FCG784NI
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;
MPF300TS-FCG784NI
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
MPF300TS-1FCG784NI
MPF300T-1FCG784NI
MPF300T-1FCG784NI by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 300,000 logic cells. It has a package style of GRID ARRAY and can operate in temperatures ranging from -40 to 100 °C. This FPGA is commonly used for various applications requiring programmable ICs.
MPF300T-FCG484E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
MPF300TLS-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 300000;
MPF300T-1FCG784I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
MPF300TS-FCS536M
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE;
MPF300TS-FCG484I
MPF300TS-FCG484I by Microchip Technology is a CMOS-based FPGA with 300,000 logic cells. It operates at a supply voltage range of 0.97V to 1.03V and has a temperature range of -40°C to 100°C. This versatile device is suitable for industrial applications requiring high-performance programmable ICs.
MPF300T-1FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .97 V;
MPF300T-1FCSG536I
MPF300T-1FCSG536I by Microchip Technology is a CMOS FPGA with 300,000 logic cells and 300 inputs/outputs. It operates b/w -40 to 100°C, with a supply voltage range of 0.97V to 1.03V. This low-profile grid array package is ideal for applications requiring high-density programmable logic solutions in compact spaces.
MPF300T-1FCVG484E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; No. of Logic Cells: 300000;
MPF300T-FCG1152E
MPF300T-FCG1152E by Microchip Tech is a 300K logic cell FPGA with CMOS tech. It has 512 inputs/outputs, operates b/w 0-100°C, and uses a grid array package style. Ideal for applications requiring high-density programmable logic in compact form factors.
MPF300TLS-FCSG536I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; No. of Outputs: 300;
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