Loading...

MPF300TL-FCG784E

Microchip Technology

MPF300TL-FCG784E by Microchip Technology

MPF300TL-FCG784E by Microchip Technology is a 300000 logic cell FPGA with CMOS technology. It has 388 inputs and outputs, operates b/w 0-100°C, and uses a grid array package style. Ideal for applications requiring high-speed data processing in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,316 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,316

-

-

-

-

Chip Stock

USA . 1,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,305

-

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Digiode

USA . 454 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

454

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 293 parts In-Stock

1+ parts

$7.206

100+ parts

-

1k+ parts

-

10k+ parts

-

293

$7.206

-

-

-

Semicontronic

India . 894 parts In-Stock

1+ parts

$16.000

100+ parts

$15.600

1k+ parts

$15.520

10k+ parts

-

894

$16.000

$15.600

$15.520

-

Ampacity Inc.

Singapore . 353 parts In-Stock

1+ parts

$30.000

100+ parts

-

1k+ parts

-

10k+ parts

-

353

$30.000

-

-

-

Corohmni

South Africa . 314 parts In-Stock

1+ parts

$79.452

100+ parts

-

1k+ parts

-

10k+ parts

-

314

$79.452

-

-

-

Aztec Data Supply Inc.

USA . 202 parts In-Stock

1+ parts

$82.883

100+ parts

-

1k+ parts

-

10k+ parts

-

202

$82.883

-

-

-

Vigor

Singapore . 200 parts In-Stock

1+ parts

$453.810

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$453.810

-

-

-

LMD Electronica

Estonia . 4,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,138

-

-

-

-

Argo Parts USA

USA . 3,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,475

-

-

-

-

Montano Global Distributors

Canada . 2,595 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,595

-

-

-

-

Continental Prestige Electronics

USA . 2,487 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,487

-

-

-

-

NIA Electronics

USA . 1,620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,620

-

-

-

-

Ledger Components

France . 1,620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,620

-

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

LOOK Integrated Logistics

Peru . 65 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

65

-

-

-

-

Corphita

USA . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60

-

-

-

-

Overview

Unlock endless possibilities with the MPF300TL-FCG784E by Microchip Technology, a cutting-edge Field Programmable Gate Array that boasts 300,000 logic cells for ultimate performance. Made from high-quality plastic/epoxy material, this FPGA offers unmatched reliability and durability. Perfect for a wide range of applications, this versatile device features 388 inputs and outputs, making it ideal for a variety of projects. Experience seamless integration and enhanced functionality with the MPF300TL-FCG784E, delivering unparalleled value and benefits to customers seeking top-tier performance in a compact package.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material is durable and provides good protection for the internal components of the FPGA, ensuring reliability and longevity.

No. of Logic Cells: 300000

Having a large number of logic cells allows for complex programmable logic designs to be implemented, making this FPGA suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability makes installation and assembly of this FPGA easier, saving time and effort in production processes.

Maximum Supply Voltage: 1.03 V

The maximum supply voltage of 1.03V ensures safe operation within specified limits, protecting the FPGA from potential damage due to overvoltage.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making this FPGA energy-efficient and reliable in various operating conditions.

No. of Inputs: 388

With a high number of inputs, this FPGA can accommodate a large number of external signals, enabling complex input-output configurations in programmable logic circuits.

Package Shape: SQUARE

The square package shape provides a compact and space-efficient design, making it suitable for applications where size constraints are a consideration.

Form Of Terminal: BALL

The ball form of terminal adds mechanical strength and thermal conductivity to the package, ensuring reliable interconnection and heat dissipation for optimal performance.

No. of Terminals: 784

Having a high number of terminals allows for versatile connectivity options and enables integration with various external components, enhancing the flexibility of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this IC type offers the flexibility to reconfigure the logic functions within the FPGA, allowing for rapid prototyping and customization.

Package Style (Meter): GRID ARRAY

The grid array package style offers a reliable and robust interconnection structure, ensuring secure mounting and efficient signal transmission for the FPGA.

Minimum Supply Voltage: 0.97 V

The minimum supply voltage of 0.97V allows for low-power operation and helps in minimizing energy consumption, making this FPGA suitable for battery-powered applications.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this FPGA can withstand high temperature environments, ensuring reliable performance in demanding conditions.

Pitch Of Terminal: 1 mm

The 1mm pitch of the terminal allows for fine-pitch mounting, enabling high-density integration and compact PCB layouts for efficient circuit designs.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable operation even in cold environments, making this FPGA suitable for a wide range of temperature conditions.

Position Of Terminal: BOTTOM

Having the terminal positioned at the bottom facilitates easy mounting and rework processes, ensuring efficient assembly and maintenance of the FPGA.

Maximum Seated Height: 3.47 mm

The maximum seated height of 3.47mm allows for low-profile installation, making this FPGA suitable for space-constrained applications and compact electronic devices.

Width: 29 mm

With a width of 29mm, this FPGA offers a compact form factor, making it suitable for applications where space-saving designs are essential.

No. of Outputs: 388

Having a high number of outputs allows for versatile signal routing options and enables complex output configurations in programmable logic circuits, enhancing the functionality of the FPGA.

Length: 29 mm

With a length of 29mm, this FPGA offers a balanced form factor, providing a versatile design that can be easily integrated into various electronic systems and applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300TL-FCG784E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

388

No. of Outputs:

388

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA784,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

Trade Compliance

MPF300TL-FCG784E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20