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MPF300TL-FCG484I

Microchip Technology

MPF300TL-FCG484I by Microchip Technology

Microchip Technology's MPF300TL-FCG484I is a 300000 logic cell FPGA with CMOS technology. Featuring 244 inputs and outputs, it operates b/w -40 to 100°C. Ideal for applications requiring high-density programmable ICs in a square grid array package.

Median Price

$522.850

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2 parts In-Stock

1+ parts

$522.850

100+ parts

$475.320

1k+ parts

$330.220

10k+ parts

-

2

$522.850

$475.320

$330.220

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 2 parts In-Stock

1+ parts

$418.280

100+ parts

$392.140

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-

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2

$418.280

$392.140

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Digiode

USA . 481 parts In-Stock

1+ parts

$550.373

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481

$550.373

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Vyrian

USA . 3,551 parts In-Stock

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3,551

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Chip Stock

USA . 1,348 parts In-Stock

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1,348

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 198 parts In-Stock

1+ parts

$5.919

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-

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198

$5.919

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Aztec Data Supply Inc.

USA . 178 parts In-Stock

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$133.590

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178

$133.590

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Corohmni

South Africa . 3 parts In-Stock

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$154.004

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3

$154.004

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Vigor

Singapore . 210 parts In-Stock

1+ parts

$476.510

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210

$476.510

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Semicontronic

India . 4 parts In-Stock

1+ parts

$492.440

100+ parts

$480.129

1k+ parts

$477.667

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4

$492.440

$480.129

$477.667

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$492.440

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1

$492.440

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Corphita

USA . 70 parts In-Stock

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$521.406

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70

$521.406

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Continental Prestige Electronics

USA . 6,961 parts In-Stock

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Montano Global Distributors

Canada . 5,912 parts In-Stock

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LOOK Integrated Logistics

Peru . 4,387 parts In-Stock

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LMD Electronica

Estonia . 3,963 parts In-Stock

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NIA Electronics

USA . 870 parts In-Stock

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Ledger Components

France . 870 parts In-Stock

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870

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Aranea Global

USA . 500 parts In-Stock

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500

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Argo Parts USA

USA . 358 parts In-Stock

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358

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Overview

Unlock the power of advanced technology with the MPF300TL-FCG484I by Microchip Technology. This top-of-the-line Field Programmable Gate Array (FPGA) boasts 300,000 logic cells and a wide range of applications in various industries. With a focus on quality and innovation, Microchip Technology delivers unmatched performance and reliability. Experience seamless integration and enhanced functionality with this FPGA, designed to meet the demands of modern technology. Upgrade your projects with the MPF300TL-FCG484I and stay ahead of the curve in a rapidly evolving market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and affordability, making the product cost-effective and sturdy.

No. of Logic Cells: 300000

With a high number of logic cells, this FPGA can handle complex operations and calculations efficiently.

Surface Mount: YES

Being surface mountable makes it easy to integrate this FPGA into various applications, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Technology Used: CMOS

CMOS technology offers low power consumption, high noise immunity, and scalability, making it a reliable choice for FPGA applications.

No. of Inputs: 244

Having a high number of inputs allows for a greater amount of data to be processed simultaneously, enhancing the product's performance.

Package Shape: SQUARE

A square package shape provides a balanced footprint and enables efficient use of PCB space, contributing to better design flexibility and layout optimization.

Form Of Terminal: BALL

Ball terminals are known for their reliability and ease of use, ensuring secure connections and making the product suitable for various mounting techniques.

No. of Terminals: 484

Having a high number of terminals allows for more connections to be made, enabling versatile applications and customization options.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGAs are known for their reprogrammability and flexibility, making them ideal for prototyping, testing, and adapting to changing design requirements.

Package Style (Meter): GRID ARRAY

A grid array package style offers increased thermal and electrical performance, along with better signal integrity and reliability.

Minimum Supply Voltage: 0.97 V

A low minimum supply voltage ensures compatibility with various power sources and contributes to energy efficiency and extended battery life.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand rigorous environmental conditions and maintain stable performance in demanding applications.

Pitch Of Terminal: 1 mm

The compact pitch of terminals allows for dense packing and precise connection arrangements, facilitating high-speed signal transmission and reducing signal interference.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation in extreme cold environments, making the product suitable for a wide range of applications.

Position Of Terminal: BOTTOM

Bottom terminal positioning simplifies PCB layout and assembly processes, enabling efficient heat dissipation and optimizing signal routing.

Maximum Seated Height: 2.87 mm

The low maximum seated height enables compact and slim designs, reducing space requirements and enhancing the product's overall aesthetics.

Width: 23 mm

The moderate width of the FPGA allows for easy integration into standard PCB layouts and facilitates efficient utilization of space in electronic systems.

No. of Outputs: 244

Having a high number of outputs enables the FPGA to drive multiple devices and circuits simultaneously, supporting complex system configurations and functionalities.

Length: 23 mm

The moderate length of the FPGA makes it compatible with standard board sizes and facilitates seamless integration into existing electronic assemblies.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300TL-FCG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

244

No. of Outputs:

244

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.87 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF300TL-FCG484I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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