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MPF100T-1FCSG325E

Microchip Technology

MPF100T-1FCSG325E by Microchip Technology

MPF100T-1FCSG325E by Microchip Technology is a CMOS-based FPGA with 170 inputs and outputs. It operates at a voltage range of 0.97V to 1.03V and has a compact package style suitable for low-profile applications.

Median Price

$158.970

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 12 parts In-Stock

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$158.970

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DigiKey

USA . 5 parts In-Stock

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$158.970

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$129.162

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Digiode

USA . 317 parts In-Stock

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$264.166

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IBS Electronics

USA . 5 parts In-Stock

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$361.608

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Vyrian

USA . 7,078 parts In-Stock

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Chip Stock

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Nova Conductors

Japan . 50 parts In-Stock

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AZTECH Wire

Italy . 732 parts In-Stock

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$17.431

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Aztec Data Supply Inc.

USA . 4,644 parts In-Stock

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$24.225

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Corohmni

South Africa . 504 parts In-Stock

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$40.882

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Vigor

Singapore . 249 parts In-Stock

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$228.710

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Ampacity Inc.

Singapore . 3 parts In-Stock

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$236.360

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Semicontronic

India . 3 parts In-Stock

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$236.360

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$230.451

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$229.269

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Corphita

USA . 263 parts In-Stock

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LOOK Integrated Logistics

Peru . 7,430 parts In-Stock

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Montano Global Distributors

Canada . 6,600 parts In-Stock

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Continental Prestige Electronics

USA . 5,278 parts In-Stock

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NIA Electronics

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Ledger Components

France . 4,672 parts In-Stock

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Argo Parts USA

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LMD Electronica

Estonia . 540 parts In-Stock

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Aranea Global

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Overview

Experience the power and versatility of the MPF100T-1FCSG325E by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology is known for its exceptional quality and innovation. This FPGA provides endless possibilities for various applications, offering customers unparalleled value. With its advanced technology and extensive inputs and outputs, the MPF100T-1FCSG325E is designed to meet the demands of any project. Whether you're creating cutting-edge electronics or revolutionizing industrial automation, this field programmable gate array is your key to success. Unlock your potential with Microchip Technology and see the advantages for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the FPGA, making it reliable for long-term use.

Surface Mount: YES

This feature allows for easy and efficient soldering onto a circuit board, making the installation process quick and convenient.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage ensures stable and reliable performance of the FPGA under various operating conditions.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA energy-efficient and reliable in noisy environments.

No. of Inputs: 170

Having a large number of inputs allows for versatile input configurations and complex logic operations, making the FPGA suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, allowing for efficient integration into a circuit board or system.

Form Of Terminal: BALL

Ball terminals offer secure connections and high signal integrity, ensuring reliable performance of the FPGA in demanding applications.

No. of Terminals: 325

A high number of terminals provide extensive connectivity options and allow for complex circuit configurations, enhancing the versatility of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, the FPGA offers flexibility in customization and reprogramming, making it ideal for prototyping and design testing.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact and low-profile design with fine pitch terminals, allowing for dense integration and high-speed signal processing capabilities.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage ensures energy efficiency and reliable operation of the FPGA even under low-power conditions.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature tolerance ensures reliable performance of the FPGA in harsh environmental conditions or high-temperature applications.

Pitch Of Terminal: 0.5 mm

The small pitch of terminals allows for high-density packaging and fine-pitch interconnection, enabling complex circuit designs and space-efficient layouts.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature tolerance ensures reliable performance of the FPGA even in cold environments or low-temperature conditions.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom of the FPGA allows for easy and secure connections in a circuit board layout, ensuring stable and reliable operation.

Maximum Seated Height: 1.45 mm

The low maximum seated height enables a slim and compact design, making the FPGA suitable for applications with space constraints or height limitations.

Width: 11 mm

The compact width of the FPGA allows for versatile placement and integration options, making it suitable for various circuit board layouts and system configurations.

No. of Outputs: 170

Having a significant number of outputs enables the FPGA to drive multiple signals or devices, providing enhanced functionality and versatility in various applications.

Length: 11 mm

The short length of the FPGA offers a compact and space-saving design, allowing for efficient placement and integration into tight spaces or small form factor systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF100T-1FCSG325E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Inputs:

170

No. of Outputs:

170

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

11 mm

Width:

11 mm

Maximum Seated Height:

1.45 mm

Package Equivalence Code:

BGA325,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

Trade Compliance

MPF100T-1FCSG325E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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