Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TLE9261QXV33XUMA1 by Infineon Technologies is a CAN FD transceiver with a data rate of 5 Mbps. It operates at a nominal voltage of 13.5 V and has a max operating temperature of 150°C. This network interface is commonly used in automotive applications for communication b/w electronic control units (ECUs).
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Plastic/epoxy material ensures durability and reliability for long-term use.
Allows for easy and convenient installation on circuit boards.
Meets automotive-grade requirements, ensuring high quality and reliability for automotive applications.
Square shape saves space and allows for efficient placement on PCBs.
Provides multiple connection points for enhanced functionality.
Innovative package style offers optimal heat dissipation and compact design.
Can withstand high temperatures, making it suitable for various operating environments.
Capable of functioning in extreme cold conditions without compromising performance.
Quad terminal position allows for efficient signal transmission and connectivity.
Low seated height enables compact and space-saving PCB layouts.
Narrow width facilitates easy integration into tight spaces.
Compact length makes it suitable for small form factor applications.
Lead-free terminal form is environmentally friendly and complies with regulations.
Low supply current consumption for energy efficiency.
Specifically designed for CAN FD communication, ensuring compatibility and reliable data transmission.
Optimal supply voltage for stable performance and efficiency.
Fine terminal pitch enables high-density connections and signal integrity.
High data rate capability for fast and efficient data transfer.
Network Interfaces TLE9261QXV33XUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
Data Rate:
JESD-30 Code:
Length:
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No. of Terminals:
No. of Transceivers:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
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Package Style (Meter):
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Maximum Supply Current:
Nominal Supply Voltage:
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Telecom IC Type:
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Width:
TLE9261QXV33XUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
2N2222A
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
2N7002
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Lite-on Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
SMBJ18CA
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
1N4148
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
Rectron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002-7-F
Diodes Incorporated
Diodes Inc. 2N7002-7-F is a N-channel FET with 60V DS breakdown voltage, 0.115A max drain current, and 13.5 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features Gull Wing terminals, small outline package style, and operates up to 150°C.
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
LM358AN
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
International Components
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Reverse Recovery Time: .004 us;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
Texas Instruments
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
DP83848IVVX/NOPB
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
DP83848YB/NOPB
DP83848YB/NOPB by Texas Instruments is an Ethernet transceiver with 100000 Mbps data rate, operating at 3.3V. It features a flatpack package style, quad terminal position, and -40 to 125 °C temperature range. Ideal for automotive applications due to its CMOS technology and compact design.
TJA1462AT/0Z
NXP Semiconductors' TJA1462AT/0Z is a CAN FD transceiver with 8 Mbps data rate. It operates at a nominal voltage of 5V and has a max supply current of 70mA. This small outline package is suitable for network interfaces in automotive applications.
MCP2542FD-E/MF
Microchip Technology
MCP2542FD-E/MF by Microchip is a CAN FD transceiver with 8 Mbps data rate, suitable for automotive applications. It operates at -40 to 125°C temperature range and requires 5V nominal voltage. The package style is small outline, heat sink/slug, very thin profile with matte tin terminal finish.
LAN8710AI-EZK-TR-ABC
LAN8710AI-EZK-TR-ABC by Microchip is a Network Interface with 32 terminals, operating at -40 to 85°C. It features Ethernet transceiver type, 100 Mbps data rate, and 1.2V supply voltage. Ideal for industrial applications requiring reliable network connectivity in compact spaces.
LAN8710A-EZC-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
TJA1021T/20/C,112
NXP Semiconductors' TJA1021T/20/C,112 is a LIN transceiver with 8 terminals in a small outline package. Operating from -40 to 150°C, it supports a nominal voltage of 12V. Ideal for automotive applications meeting AEC-Q100 standards, this device features gull wing terminals and nickel palladium gold finish.
DP83620SQ/NOPB
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: QCCN; Package Shape: SQUARE;
TJA1021T/20/CM,118
NXP Semiconductors' TJA1021T/20/CM,118 is a LIN transceiver with 8 terminals, AEC-Q100 screening, and 12V supply voltage. It operates b/w -40°C to 150°C, suitable for automotive network interfaces. The small outline package measures 4.9mm x 3.9mm x 1.75mm and supports surface mount assembly.
KSZ9897STXC
Microchip Technology's KSZ9897STXC is an Ethernet transceiver with 128 terminals in a square package. Operating temperature ranges from 0 to 70°C, suitable for commercial use. It features matte tin terminal finish and quad terminal position, ideal for network interfaces.
LAN9303-ABZJ
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;
ATA6561-GBQW-N
ATA6561-GBQW-N by Microchip: CAN FD transceiver with 5 Mbps data rate, 70 mA supply current, and 5V nominal voltage. Ideal for automotive applications due to TS16949 screening level and -40 to 150 °C operating temperature range.
KSZ8851SNL
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
TCAN4550RGYTQ1
TCAN4550RGYTQ1 by Texas Instruments is an automotive-grade interface circuit with a 12V supply voltage. It operates at temperatures ranging from -40 to 125°C and supports data rates up to 8 Mbps. This chip carrier package with 20 terminals is designed for network interfaces in automotive applications.
PM8800ATR
PM8800ATR by STMicroelectronics is a network interface IC with 16 terminals, operating b/w -40 to 85°C. It features a small outline package style and supports circuits in telecom applications. With a terminal pitch of 0.65mm, it has a nominal voltage of 1.8V and peak reflow temperature of 260°C.
KSZ9031MNXCA
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;
KSZ8041TL
Microchip Technology's KSZ8041TL is a Network Interface with 100 Mbps data rate, 3.3V supply voltage, and 58.3mA supply current. It is an Ethernet transceiver suitable for commercial temperature grade applications in various electronic devices requiring network connectivity.
KSZ8081RNAIA-G3XX-TR
KSZ8081RNAIA-G3XX-TR by Microchip is a 24-terminal Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85 °C. It features a square chip carrier package style suitable for industrial applications requiring reliable network interfaces. The IC has a terminal pitch of 0.5 mm and operates at a nominal voltage of 3.3 V.
MC33664ATL1EG
INTERFACE CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
NCV7342D10R2G
Onsemi
NCV7342D10R2G by Onsemi is a CMOS interface circuit with 8 terminals, operating at 5V. It has a data rate of 1 Mbps and is AEC-Q100 compliant for automotive applications. With a compact small outline package style, it is designed for surface mount assembly in harsh environments.
TJA1042T/1J
NXP Semiconductors' TJA1042T/1J is an automotive-grade network interface IC with 8 terminals, operating from -40 to 125°C. It features a small outline package, Gull Wing terminal form, and supports a nominal voltage of 5V. Ideal for interface circuits in automotive applications requiring robust communication solutions.
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TLE9251VSJXUMA1
Infineon Technologies
TLE9251VSJXUMA1 by Infineon Technologies is a network interface IC with 8 terminals and a small outline package style. It operates at a nominal voltage of 5V and has a max seated height of 1.73mm. This IC is commonly used in telecom applications for interface circuit purposes.
TLE9252VLCXUMA1
INTERFACE CIRCUIT; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 2A; JESD-609 Code: e3;
TLE9252VSKXUMA1
TLE9252VSKXUMA1 by Infineon is a CAN FD transceiver with 5 Mbps data rate, AEC-Q100 screening, and 5V supply voltage. Ideal for automotive applications due to its small outline package and operating temperature range of -40 to 150°C.
TLE9255WSKXUMA2
TLE9255WSKXUMA2 by Infineon Technologies is a small outline network interface IC with 14 terminals, GULL WING form, and 1.27mm pitch. It operates at 5V nominal voltage and AEC-Q100 screening level suitable for automotive applications. The package dimensions are 4mm x 8.75mm x 1.75mm, making it ideal for compact designs in the automotive industry.
TLE9251VLEXUMA1
TLE9251VLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 0.65mm terminal pitch. It is designed for automotive applications requiring a small outline package with heat sink, suitable for surface mount assembly. The IC's compact size of 3x3mm and low seated height of 1.1mm make it ideal for space-constrained environments in vehicles.
TLE9255WLCXUMA1
TLE9255WLCXUMA1 by Infineon Technologies is a network interface IC with 14 terminals, AEC-Q100 screening level, and 5V nominal voltage. It is designed for automotive applications requiring a small outline package with surface mount capability and dual terminal position.
TLE9250XLEXUMA1
TLE9250XLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 0.65mm pitch, and 5V supply voltage. Its small outline package makes it suitable for automotive applications requiring a compact design and high reliability in harsh environments. The no-lead terminal form and thin profile enhance space efficiency while ensuring robust performance.
TLE9250XSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: NICKEL GOLD PALLADIUM;
TLE9250VSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
TLE9250SJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE9250LEXUMA1
TLE9250LEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 0.65mm terminal pitch. It is a small outline package suitable for automotive applications requiring network interfaces. The IC features a square shape, tin finish, and thin profile design for space-constrained installations.
TLE9251VSJXUMA1/SAMPLE
INTERFACE CIRCUIT;
TLE9250VLEXUMA1
TLE9250VLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and tin terminal finish. It operates at a nominal voltage of 5V and has a terminal pitch of 0.65mm. Ideal for automotive applications requiring network interfaces in compact spaces.
TLE92613BQXXUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
TLE9261BQXV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
TLE9261BQXXUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Supply Current: 6.5 mA;
TLE94613ESV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: HTSSOP; Package Shape: RECTANGULAR; Package Equivalence Code: TSSOP24,.25;
TLE9351VSJXTMA1
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
TLE92613BQXV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .5 mm;
TLE9271QXV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC48,.27SQ,20;
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