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SAF-XC878CM-16FFI3V3

Infineon Technologies

SAF-XC878CM-16FFI3V3 by Infineon Technologies

SAF-XC878CM-16FFI3V3 by Infineon: 8-bit microcontroller with 64 terminals, 20 MHz clock frequency, and 8 ADC channels. Ideal for industrial applications requiring CAN, SSC, UART connectivity and low power mode.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 899 parts In-Stock

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899

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Digiode

USA . 140 parts In-Stock

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140

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Ampacity Inc.

Singapore . 357 parts In-Stock

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$1.000

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357

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AZTECH Wire

Italy . 304 parts In-Stock

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$7.167

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Semicontronic

India . 574 parts In-Stock

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$30.000

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$29.250

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$29.100

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$29.100

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Andel Nordic

Denmark . 5,885 parts In-Stock

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$33.673

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$33.673

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Modulus Dynamics

Lithuania . 3,226 parts In-Stock

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$59.931

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$57.534

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$55.137

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Continental Prestige Electronics

USA . 6,612 parts In-Stock

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Argo Parts USA

USA . 4,164 parts In-Stock

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Bastille Electronics

Australia . 1,951 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge technology with the SAF-XC878CM-16FFI3V3 microcontroller by Infineon Technologies. Crafted with precision and expertise, this device offers unparalleled performance and reliability in a compact package. Ideal for a wide range of applications, this microcontroller is designed to meet the demands of industrial-grade tasks with ease. Experience seamless connectivity, low power consumption, and high-speed processing capabilities that will take your projects to the next level. Elevate your designs with the SAF-XC878CM-16FFI3V3 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount packaging saves space on the PCB and offers easier assembly, making the product ideal for compact designs.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for better performance and flexibility in various power supply scenarios.

On Chip Data RAM Width: 8

A wider data RAM width allows for faster data processing and improved overall performance of the microcontroller.

No. of Terminals: 64

Having a higher number of terminals provides more connectivity options and interfaces for peripherals, making the product versatile.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh industrial environments where temperature fluctuations can occur.

No. of External Interrupts: 7

Multiple external interrupts allow the microcontroller to respond quickly to external events, enhancing its real-time responsiveness.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various peripherals integrated on-chip simplifies system design and reduces external component count.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the program code, making the product flexible and future-proof.

Technical Specifications

Microcontrollers SAF-XC878CM-16FFI3V3 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

YES

CPU Family:

XC800

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of External Interrupts:

7

No. of I/O Lines:

40

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Bytes:

3328

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

45 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), SSC, UART(2)

Peripherals:

BOD, POR, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

SAF-XC878CM-16FFI3V3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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