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SAF-XC164CS-16F40FBB

Infineon Technologies

SAF-XC164CS-16F40FBB by Infineon Technologies

SAF-XC164CS-16F40FBB by Infineon: 16-bit microcontroller with 2.35-2.7V supply, 16MHz clock, and 24-bit address bus. Ideal for industrial applications requiring FLASH ROM programmability, ADC & PWM channels, and operating temperatures from -40 to 85°C. Package style is flatpack with low profile and fine pitch design.

Median Price

$42.650

Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 10,740 parts In-Stock

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Digiode

USA . 899 parts In-Stock

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Vyrian

USA . 519 parts In-Stock

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519

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Rutronik

Germany . 440 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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Goldney Electronics S.L.

Spain . 9 parts In-Stock

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AZTECH Wire

Italy . 519 parts In-Stock

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$17.158

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Ampacity Inc.

Singapore . 1,096 parts In-Stock

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Corohmni

South Africa . 216 parts In-Stock

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Modulus Dynamics

Lithuania . 4,665 parts In-Stock

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$78.104

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$74.980

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$71.856

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A-Z Elektronik GmbH

Germany . 7,556 parts In-Stock

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Continental Prestige Electronics

USA . 6,614 parts In-Stock

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S.R.D Solutions

India . 1,000 parts In-Stock

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Argo Parts USA

USA . 413 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 77 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the SAF-XC164CS-16F40FBB microcontroller by Infineon Technologies. Built with precision and expertise, this innovative device offers unparalleled performance and reliability in a variety of applications. Whether you're looking to enhance your industrial processes or streamline your automation systems, this microcontroller delivers exceptional value and efficiency. Trust in the quality and advantages of Infineon Technologies to take your projects to the next level. Experience the benefits and advantages of the SAF-XC164CS-16F40FBB today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection to the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount capability makes it easier to integrate the microcontroller onto a PCB, saving space and simplifying assembly.

Maximum Supply Voltage: 2.7 V

Having a maximum supply voltage of 2.7 V allows for flexibility in power supply options while ensuring safe operation of the microcontroller.

Address Bus Width: 24

A wide address bus width of 24 allows for efficient communication and data transfer within the microcontroller.

Package Shape: SQUARE

The square package shape enables easy handling and placement of the microcontroller on a PCB, optimizing space utilization.

Bit Size: 16

A bit size of 16 enables the microcontroller to process data and instructions efficiently, making it suitable for various applications.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with other components and peripherals, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style contributes to a compact and streamlined design, ideal for space-constrained applications.

Minimum Supply Voltage: 2.35 V

With a minimum supply voltage of 2.35 V, the microcontroller can operate efficiently even at low power levels, conserving energy.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures the resilience of the microcontroller in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows the microcontroller to function reliably in a wide range of temperature environments.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring stable connections and longevity of the microcontroller.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals into digital data, expanding its capability to interface with sensors and other analog devices.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and soldering process, enhancing ease of integration and reliability of the microcontroller.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6 mm allows for a slim profile, facilitating compact system designs and efficient use of space.

Width: 14 mm

With a width of 14 mm, the microcontroller is compact and space-saving, making it suitable for applications where size constraints are crucial.

External Data Bus Width: 16

A data bus width of 16 enables high-speed data transfer and processing, enhancing the overall performance of the microcontroller.

Maximum Clock Frequency: 16 MHz

The maximum clock frequency of 16 MHz allows for rapid data processing and execution of instructions, making the microcontroller suitable for tasks requiring high speed.

Length: 14 mm

With a length of 14 mm, the microcontroller maintains a compact form factor, contributing to space efficiency and easy integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures the microcontroller's reliability and stable performance in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it offers integrated processing, memory, and I/O capabilities in a single chip, simplifying system design and reducing component count.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and robust connections, ensuring the microcontroller's longevity and reliability in operation.

Nominal Supply Voltage: 2.5 V

Having a nominal supply voltage of 2.5 V ensures compatibility with standard power sources, simplifying the power supply architecture for the microcontroller.

PWM Channels: YES

PWM channels enable precise control of analog devices, such as motors and LEDs, expanding the microcontroller's application capabilities.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible and efficient firmware updates, making it easy to adapt the microcontroller to evolving system requirements.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm provides fine-pitch connections, enhancing the microcontroller's connectivity options and facilitating compact PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller has a moderate sensitivity to moisture, requiring standard handling and storage procedures to maintain its integrity.

Speed: 40 rpm

A speed rating of 40 rpm indicates the microcontroller's processing capability, suitable for real-time applications and tasks requiring quick response times.

No. of I/O Lines: 79

Having 79 I/O lines offers versatile connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's adaptability to various system requirements.

Technical Specifications

Microcontrollers SAF-XC164CS-16F40FBB attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

79

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SAF-XC164CS-16F40FBB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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