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SAF-XC878CM-16FFI5VAA

Infineon Technologies

SAF-XC878CM-16FFI5VAA by Infineon Technologies

SAF-XC878CM-16FFI5VAA by Infineon: 8-bit microcontroller with 64 terminals, 65536 ROM words, and 20 MHz clock frequency. Ideal for industrial applications requiring CAN, SSC, UART connectivity and featuring BOD, POR, TIMER(4), WDT peripherals. Operating temperature range from -40 to 85 °C.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,443 parts In-Stock

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5,443

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Digiode

USA . 683 parts In-Stock

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Nova Conductors

Japan . 97 parts In-Stock

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97

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Distributors (Availability)

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AZTECH Wire

Italy . 781 parts In-Stock

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$6.746

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$6.746

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Ampacity Inc.

Singapore . 619 parts In-Stock

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$19.000

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619

$19.000

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Semicontronic

India . 1,105 parts In-Stock

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$35.000

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$34.125

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$33.950

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1,105

$35.000

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$33.950

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Modulus Dynamics

Lithuania . 3,887 parts In-Stock

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$45.485

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$43.666

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$41.846

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3,887

$45.485

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$41.846

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Argo Parts USA

USA . 3,273 parts In-Stock

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Bastille Electronics

Australia . 2,262 parts In-Stock

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Continental Prestige Electronics

USA . 1,582 parts In-Stock

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Microchip USA

USA . 1,214 parts In-Stock

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Corphita

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Overview

Unlock the power of innovation with the SAF-XC878CM-16FFI5VAA by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality microcontrollers that offer unparalleled performance and reliability. Designed for a wide range of applications, this versatile product provides customers with advanced features and cutting-edge technology. With its high-speed operation, low power consumption, and extensive connectivity options, the SAF-XC878CM-16FFI5VAA is the perfect solution for your next project. Experience the value and benefits of Infineon's expertise with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and making the product suitable for smaller applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, the product can handle a wide range of power inputs, increasing flexibility in usage.

Package Shape: SQUARE

Square package shape helps in easy mounting on PCBs and ensures a consistent form factor for standardized design layouts.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost, making the product suitable for various embedded applications.

No. of Terminals: 64

Having 64 terminals allows for versatile connectivity options and interfacing with external components, enhancing the product's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving benefits, enabling compact PCB designs suitable for portable or space-constrained devices.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5V ensures stable operation even under lower power supply conditions, improving the product's reliability.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance makes the product suitable for industrial environments where elevated temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can function in a wide range of temperature conditions, increasing its versatility.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, making the product suitable for sensor interfacing and data acquisition applications.

Terminal Position: QUAD

Quad terminal position facilitates easier PCB layout and routing, simplifying the assembly process and reducing production time.

ROM Words: 65536

Large ROM capacity of 65536 words allows for storing complex firmware and program instructions, enhancing the product's processing capabilities.

Maximum Seated Height: 1.6 mm

Low maximum seated height enables the product to be used in slim devices with height constraints, expanding its applicability in various form factors.

Width: 10 mm

Compact width of 10mm allows for efficient space utilization on the PCB, contributing to overall system miniaturization.

Peripherals: BOD, POR, TIMER(4), WDT

Presence of various peripherals such as Brown-Out Detector (BOD), Power-On Reset (POR), Timers, and Watchdog Timer (WDT) enhances system reliability and functionality.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency of 20 MHz enables fast data processing and execution speed, suitable for real-time applications requiring quick response times.

Length: 10 mm

Short length of 10mm contributes to the overall compactness of the product, allowing for integration into small and space-efficient designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions commonly found in industrial settings.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product integrates processing, memory, and I/O functionalities in a single chip, offering a cost-effective and space-efficient solution for embedded systems.

RAM Bytes: 3328

A generous RAM capacity of 3328 bytes allows for efficient data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy electrical environments.

Terminal Form: GULL WING

Gull-wing terminal form facilitates easy soldering and PCB assembly, ensuring robust electrical connections and mechanical stability.

Analog To Digital Convertors: 8-Ch 10-Bit

Integrated 8-channel 10-bit ADCs enable precise analog-to-digital conversion for sensor interfacing and signal processing applications, enhancing the product's versatility.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V ensures compatibility with standard power sources, simplifying system design and integration.

PWM Channels: YES

Presence of PWM channels allows for precise control of analog outputs, enabling applications such as motor control, LED dimming, and power regulation.

Connectivity: CAN, SSC, UART(2)

Integrated connectivity options including CAN, SSC, and UART interfaces facilitate communication with peripherals and external devices, expanding the product's interfacing capabilities.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and program code in-system, ensuring easy maintenance and future-proofing of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density PCB integration, allowing for more components to be packed in a limited space, enhancing overall system functionality.

Speed: 24 rpm

Operational speed of 24 rpm ensures efficient data processing and computation, meeting the requirements of various real-time applications.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits allows for storage and execution of program instructions, enabling the product to perform complex operations efficiently.

No. of I/O Lines: 40

Having 40 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, enhancing the product's versatility in application development.

Technical Specifications

Microcontrollers SAF-XC878CM-16FFI5VAA attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

40

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

3328

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, SSC, UART(2)

Peripherals:

BOD, POR, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

SAF-XC878CM-16FFI5VAA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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