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SAFXC167CI32F40FBB-AT

Infineon Technologies

SAFXC167CI32F40FBB-AT by Infineon Technologies

Infineon's SAFXC167CI32F40FBB-AT is a 16-bit microcontroller with 24-bit address bus, 16 MHz clock frequency, and 144 terminals. Ideal for industrial applications, it features ADC with 16 channels, RTC, and PWM support. With connectivity options like CAN, I2C, SPI, and operating temperature range of -40 to 85 °C, it offers versatile performance in compact FLATPACK package.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,497 parts In-Stock

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Digiode

USA . 70 parts In-Stock

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70

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Nova Conductors

Japan . 58 parts In-Stock

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58

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Distributors (Availability)

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Semicontronic

India . 1,481 parts In-Stock

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$1.000

100+ parts

$0.975

1k+ parts

$0.970

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1,481

$1.000

$0.975

$0.970

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Ampacity Inc.

Singapore . 709 parts In-Stock

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$6.000

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709

$6.000

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AZTECH Wire

Italy . 701 parts In-Stock

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$7.036

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701

$7.036

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Corohmni

South Africa . 128 parts In-Stock

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$24.314

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128

$24.314

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Aztec Data Supply Inc.

USA . 206 parts In-Stock

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$81.390

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206

$81.390

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Modulus Dynamics

Lithuania . 3,620 parts In-Stock

1+ parts

$82.376

100+ parts

$79.081

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$75.786

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3,620

$82.376

$79.081

$75.786

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Continental Prestige Electronics

USA . 4,173 parts In-Stock

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4,173

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Argo Parts USA

USA . 3,902 parts In-Stock

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3,902

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Bastille Electronics

Australia . 2,329 parts In-Stock

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Advanced Electronics

New Zealand . 900 parts In-Stock

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900

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Corphita

USA . 763 parts In-Stock

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763

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Overview

Discover the Infineon Technologies SAFXC167CI32F40FBB-AT microcontroller, a cutting-edge solution for your electronic projects. With its high-quality manufacturing and wide range of applications, this versatile device offers unmatched value and performance. Whether you're designing automotive systems, industrial controls, or consumer electronics, this microcontroller delivers seamless connectivity, advanced features, and reliable operation. Trust Infineon to provide the innovative technology you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability while keeping the overall weight of the microcontroller low.

Surface Mount: YES

Surface mount technology allows for easy assembly and compact design, making it suitable for space-constrained applications.

Maximum Supply Voltage: 2.7 V

The low maximum supply voltage helps in reducing power consumption and heat generation in the system.

ADC Channels: YES

Having Analog to Digital Converter (ADC) channels allows for easy interfacing with analog sensors and signals, increasing the versatility of the microcontroller.

Speed: 40 rpm

The high speed of 40 rpm enables quick data processing and response time, making it suitable for real-time applications.

Connectivity: ASC(2), CAN(2), I2C, SPI(2)

Multiple connectivity options such as ASC, CAN, I2C, and SPI facilitate seamless communication with other devices and peripherals in a networked environment.

Technical Specifications

Microcontrollers SAFXC167CI32F40FBB-AT attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

103

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SPI(2)

Peripherals:

RTC, TIMER(11), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

SAFXC167CI32F40FBB-AT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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